Lg Electronics Inc.

Chippac, Inc.

Samsung Electronics Co., Ltd.

Korea University Research and Business Foundation

JongWoo Ha

Jeonghyu Yang

Wonwoo Lee

Yeonoh Nam

Myongyoung Lee

Seoksoo Lee

Yongtaek Gong

Seungjong Choi

Seokpan Kang

Sangchurl Nam

Saem Park

Kyungmee Lee

Taebok Jung

Jung-Hyun Lee

Sanggeun Lee

Jeong-Soo Lee

Kyu-Sun Shim

Disclosed are a signal processing device and an image display apparatus including the same. The signal processing device of an embodiment of the present disclosure includes: a quality calculator configured to calculate a source quality of an image signal received from an external settop box or a network; an image quality setter configured to set an image quality of the image signal based on the calculated source quality; and an image quality processor configured to perform image quality processing on the image signal based on the set image quality, wherein in response to the source quality of the received image signal being changed at a first time point, the image quality setter changes an image quality setting sequentially from a first setting to a second setting; and based on the image quality setting, the image quality processor performs image quality processing. Accordingly, flicker may be reduced when an image quality is changed due to a change in the source quality of the received image signal.

Signal processing device and video display device comprising same

Disclosed are a signal processing device and an image display apparatus including the same. The signal processing device of an embodiment of the present disclosure includes: a quality calculator configured to calculate an source quality of an image signal received from an external settop box or a network; an image quality setter configured to set an image quality of the image signal based on the calculated source quality; and an image quality processor configured to perform image quality processing on the image signal based on the set image quality, wherein in response to the source quality of the received image signal being changed at a first time point, the image quality setter changes an image quality setting sequentially from a first setting to a second setting; and based on the image quality setting, the image quality processor performs image quality processing. Accordingly, flicker may be reduced when an image quality is changed due to a change in the source quality of the received image signal.

A method and apparatus provide an Internet service in a mobile communication terminal. The method includes determining a user interest subject from user data existing within the mobile communication terminal, collecting service items through network access, determining a subject for each of the collected service items, determining relevance between the user interest subject and each of the service items, and recommending a service item according to the relevance.

Method and apparatus for providing internet service in mobile communication terminal

A multichip package has a leadframe including peripheral leads arranged about a centrally situated die paddle. A first die is attached to a first side of the leadframe die paddle. The second side of the leadframe is partially cut away so that an outer part of the die paddle is thinner, and an inner part of the leads is thinner. These partially cutaway portions in the second side of the leadframe provide a cavity, in which a second die is attached active side upward. The lower die may have bond pads near the center of the active surface, and electrical interconnection of the lower die may be made by wire bonds running through the gap between the die paddle and the leads; or, the lower die may be attached, and electrically interconnected, by flip chip interconnect to the die attach side of the cavity in the leadframe.

Multichip leadframe package

A multichip package has a leadframe including peripheral leads arranged about a centrally situated die paddle. A first ('upper') die is attached to a first ('top') side of the leadframe die paddle, which can be generally flat. The second (&#x201c;bottom&#x201d;) side of the leadframe is partially-cut away (such as by partial etching), so that an outer part of the die paddle is thinner, and so that an inner part of the leads is thinner. These partially cutaway portions in the second (&#x201c;bottom&#x201d;) side of the leadframe provide a cavity, in which a second (&#x201c;lower&#x201d;) die is attached active side upward. The lower die may have bond pads situated near the center of the active surface, and electrical interconnection of the lower die may be made by wire bonds running through the gap between the die paddle and the leads; or, the lower die may be attached, and electrically interconnected, by flip chip interconnect to the die attach side of the cavity in the leadframe. Also, multipackage modules include at least one such multichip leadframe package.

Growing community of inventors

Seoul, South Korea

JongWoo Ha