Gwangju Institute of Science and Technology

Jongwon Yoon

Heung Cho Ko

Seong-Ju Park

Seok Ho Kim

Hun Soo Jang

Young Kyu Hwang

Su Ok Yun

Hyun-A Cho

Byeong-Il Noh

Jaeyi Chun

Seonggwang Yoo

Heeje Kim

Yunkyung Jeong

Youngkyu Hwang

The present disclosure relates a method for transfer printing of an electronic device comprising: forming a sacrificial layer on a handling substrate; forming a protective layer on the sacrificial layer; forming a polymer substrate on the protective layer; forming a pattern on the polymer substrate, and forming a ciliary adhesive rod on the sides of the polymer substrate; forming a supportive layer on the polymer substrate on which the adhesive rod is formed; and removing the sacrificial layer and the protective layer, and transfer printing the electronic device onto an object to-be-printed, while dissolving the to supportive layer.

Cilia-assisted transfer printing of electronic devices

The present disclosure provides a method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling substrate. The substrate for transfer printing includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate. The present invention allows a process of manufacturing a device to be stably performed on an ultrathin substrate and may secure high degree of alignment and high transfer yield in a transfer printing process.

Method for fabricating transfer printing substrate using concave-convex structure, transfer printing substrate fabricated thereby and application thereof

A method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling substrate. The substrate includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate. This process of manufacturing provides a device to be stably performed on an ultrathin substrate and may secure high degree of alignment and high transfer yield in a transfer printing process.

Growing community of inventors

Gwangju, South Korea

Jongwon Yoon