Samsung Electronics Co., Ltd.

Jongsup Song

Taehyun Lee

Tetsuo Ariyoshi

Seolyoung Choi

Kyoungjun Kim

Seol-young Choi

A flash light emitting diode (LED) package includes: a first substrate including first and second opposing surfaces; an LED device on the first surface of the first substrate and having a light emitting region; a shutter on the LED device, and configured to expose and cover the light emitting region; a second substrate on the second surface of the first substrate; and a shutter driving unit on the second substrate and configured to move the shutter. The shutter driving unit includes: a magnetic field forming unit configured to generate a magnetic field in response to application of a current, a power generation unit having a permanent magnet and configured to generate power and/or movement in response to the magnetic field, and a power transmission unit connected between the shutter and the power generation unit and configured to transmit the power and/or movement to move the shutter.

Flash LED modules

Augmented reality glasses include a left eye lens part and a right eye lens part, each of the left eye lens part and the right eye lens part having a display area configured to display an augmented reality image, and a tracking area surrounding the display area, the tracking area including a plurality of light emission parts configured to emit light having a wavelength in an infrared band, and a frame including a left eye lens support area, a right eye lens support area, and a nose bridge connecting the left lens support area and the right lens support area, the left eye lens support area supporting the left eye lens part, and the right eye lens support area supporting the right eye lens part.

Augmented reality lenses, and augmented reality glasses and augmented reality system including the same

A light-emitting diode (LED) package includes an LED chip on a substrate, an adhesive phosphor film on the LED chip, a cell lens on the adhesive phosphor film, and a lateral reflective layer covering respective lateral surfaces of the LED chip, the adhesive phosphor film, and the cell lens, a lateral surface of the lateral reflective layer being coplanar with a lateral surface of the substrate.

Light-emitting diode package and electronic device including the same

A light emitting diode (LED) package includes a substrate having a pair of first wiring electrodes and a pair of second wiring electrodes, an LED chip on the substrate, the LED chip being electrically connected to the pair of first wiring electrodes, a wavelength conversion film on the LED chip, an electrochromic film on the wavelength conversion film, the electrochromic film electrically connected to the pair of second wiring electrodes, and the electrochromic film being configured to have a first color before application of a voltage and to be transparent after application of the voltage, an optical lens on the electrochromic film, and a lateral structure having a reflective layer covering at least a portion of a lateral surface of each of the LED chip and the wavelength conversion film, and a color layer on the reflective layer and having a second color.

Light emitting diode package and electronic device including the same

A wiring board includes: a metal plate having first and second surfaces opposite to each other, and having at least one through-hole penetrating through the first and second surfaces; at least one conductive via respectively disposed in the through-hole and spaced apart from the metal plate; an insulating structure including at least one through-insulating portion disposed between the through-hole and the conductive via, and a first insulating layer and a second insulating layer extending from the through-insulating portion and disposed in first regions surrounding the conductive via, on the first surface and the second surface, respectively; at least one first upper pad disposed on the first insulating layer and electrically connected to the conductive via; at least one first lower pad disposed on the second insulating layer and electrically connected to the conductive via; a second upper pad disposed on the first surface of the metal plate; and a second lower pad disposed on the second surface of the metal plate and electrically connected to the first upper pad through the metal plate.

Wiring board and electronic device module

A light source package includes: a substrate; a first light source device disposed on the substrate, and configured to emit a light of a first wavelength; a second light source device disposed to be spaced apart from the first light source on the substrate, and configured to emit a light of a second wavelength, different from the first wavelength; and a light transmissive structure disposed above first and second light source devices, and including at least one first lens configured to increase a beam angle of the light of the first wavelength and at least one second lens configured to reduce a beam angle of the light of the second wavelength.

Light source package and mobile device including the same

A light emitting diode (LED) module includes a substrate, an LED package, a light sensor and a lens. The LED package includes a light emitting region and is mounted on an upper surface of the substrate. The light sensor includes a light receiving region and is mounted on the upper surface of the substrate horizontally adjacent the LED package. The lens is vertically aligned over the light emitting region of the LED package and at least partially overlaps the light receiving region of the light sensor.

Light-emitting diode (LED) module and device including the same

A light source package includes a substrate, a light emitting device disposed on the substrate, a lens disposed on the light emitting device, a housing disposed on the substrate, and a conductive member disposed in the housing. The lens is spaced apart from the light emitting device, the housing is disposed on a side surface and a portion of a top surface of the lens, and the conductive member is electrically connected to the light emitting device.

Growing community of inventors

Hwaseong-si, South Korea

Jongsup Song