Samsung Electronics Co., Ltd.

Jongsu Kim

Donghoon Lee

Seunghoon Lee

Daehaeng Cho

Youngjoo Lee

Younghwan Kim

Taejoong Kim

Eunyoung Kwon

Junbum Park

Sungha Kim

Doohyun Cho

Dasom Lee

Sungho Jang

Gawon Lee

Hyungseok Yu

Kwangsung Lee

Taeckki Lee

Kijoo Hong

Yoojin Jeong

Jonghyeon Lee

Youngsu Ryu

Min Whoa Hong

Hyounggon Kim

Jeongsu Ha

Wansung Park

Jaeyoun Wi

Seunghyeon Cho

Hakhyun Kim

Yangkeun Kim

An electronic device is provided. The electronic device includes a communication module communicable with an external device, a display, a memory, and at least one processor operatively connected to the communication module, wherein the at least one processor is configured to display at least one image and/or text related to payment information on the display in response to at least a part of a user input, determine whether to start a payment process in response to identification of a user authentication, transmit a first signal for requesting an authentication to the external device in response to identification of an approach of the external device within a predetermined distance from the electronic device, and transmit a second signal related to the payment process in response to identification of an authentication of the external device, and determine whether to complete the payment process using the electronic device.

Electronic device and payment method using the same

According to certain embodiments, an electronic device comprises: a secure element storing at least one content application and backup data associated with the at least one content application; a memory storing instructions; and a processor electrically connected to the secure element and the memory and configured to executed the instructions, wherein execution of the instructions by the processor causes the processor to perform a plurality of operations comprising: when receiving a message requesting a backup operation from an external electronic device, loading encrypted backup data from the secure element, transmitting the backup data to the external electronic device, and when receiving a message about backup completion from the external electronic device, setting the backup data to an unavailable state.

Electronic device and method of backing up secure element

Various embodiments of the present invention relate to an electronic device for providing a service by using a secure element, and an operating method thereof. The electronic device comprises: a processor for acquiring secure state information of the electronic device; and a secure element operating under the control of the processor, receiving the secure state information of the electronic device from the processor, and including a repository for storing the received secure state information of the electronic device, wherein the secure element senses a security-related service request command, acquires the secure state information about the electronic device from the repository, and can process or ignore the sensed security-related service request command on the basis of whether the acquired secure state information of the electronic device satisfies a designated condition. Other embodiments are also possible.

Electronic device for providing service by using secure element, and operating method thereof

A thickness estimation method may include: obtaining a test spectrum image; obtaining test spectrum data; measuring a thickness of a test layer formed on the test substrate at the plurality of positions; generating a regression analysis model using a correlation between the thickness of the test layer and the test spectrum data; obtaining a spectrum image; and estimating a thickness of a target layer over the entire area of the semiconductor substrate by applying the spectrum image to the regression analysis model. The thickness corresponding to the entire area of the semiconductor substrate that is being transferred is estimated using the thickness estimation method according to an exemplary embodiment in the present disclosure, such that whether or not processing is normally performed may be examined without requiring a separate time. In addition, an examination result may be feedbacked to processing equipment to improve production yield.

Thickness estimation method and processing control method

A thickness estimating apparatus includes a transfer robot, a light source, a camera, a memory and a controller. The memory stores a thickness predicting model generated based on a data set including a thickness of at least one of a test wafer corresponding to the wafer or a test element layer formed on the test wafer, and the thickness predicting model being trained to minimize a loss function of the data set. The controller applies pixel data, which is acquired from at least one pixel selected from a plurality of pixels included in a captured image, to the thickness predicting model, to predict a thickness of at least one of the wafer or an element layer formed on the wafer in a position corresponding to a position of the selected pixel.

Wafer inspection apparatus and method

A semiconductor substrate measuring apparatus includes a light source to generate irradiation light having a sequence of on/off at a predetermined interval, the light source to provide the irradiation light to a chamber with an internal space for processing a semiconductor substrate using plasma, an optical device between the light source and the chamber, the optical device to split a first measurement light into a first optical path, condensed while the light source is turned on, to split a second measurement light into a second optical path, condensed while the light source is turned off, and to synchronize with the on/off sequence, and a photodetector connected to the first and second optical paths, the photodetector to subtract spectra of first and second measurement lights to detect spectrum of reflected light, and to detect plasma emission light emitted from the plasma based on the spectrum of the second measurement light.

Semiconductor substrate measuring apparatus and plasma treatment apparatus using the same

An optical emission spectroscopy (OES) calibration system includes a chamber, an adapter, an OES device, a calibration device, and a spectrometer. The chamber includes a viewport. The adapter is fastened to the viewport, and includes a first beam splitter and a second beam splitter. The OES device detects plasma light generated in the chamber and transmitted through the adapter and generates OES data based on the detected plasma light. The calibration device includes a light source, and generates correction data for compensating for deviations in the OES data. The spectrometer detects light emitted from the light source and split by the first beam splitter or the second beam splitter. Each of the OES device, the calibration device, and the spectrometer is fastened to the adapter through an optical cable, and the calibration device generates the correction data using an intensity of light detected by the spectrometer.

Optical emission spectroscopy calibration device and system including the same

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Seongnam-si, South Korea

Jongsu Kim