Soonchunhyang University Industry Academy Cooperation Foundation

Jongsik Lim

Dal Ahn

Disclosed are a microstrip transmission line having a common defected ground structure (DGS) and a wireless circuit apparatus having the same. The microstrip transmission line realizes a common defected ground structure (DGS) and a double microstrip structure, and includes: a first dielectric layer; a first signal line pattern formed on a first surface of the first dielectric layer; a common ground conductive layer formed on a second surface of the first dielectric layer and having a defected ground structure, the first surface facing the second surface; a second dielectric layer having a first surface brought into contact with the common ground conductive layer, and facing the first dielectric layer while interposing the common ground conductive layer between the first dielectric layer and the second dielectric layer; and a second signal line pattern formed on a second surface of the second dielectric layer, the first surface facing the second surface.

Double microstrip transmission line having common defected ground structure and wireless circuit apparatus using the same

Disclosed herein is a dual band high frequency amplifier using a composite right/left handed (CRLH) transmission line (TL). Accordingly, a CRLH TL structure having a dual band characteristic is inserted into an input matching circuit and/or an output matching circuit in the high frequency amplifier, and a matching circuit is designed so that impedance matching is performed at two frequencies, thereby obtaining both gain and matching characteristics at the two frequencies.

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Daejeon, South Korea

Jongsik Lim