Samsung Electronics Co., Ltd.

Jongpil Lee

Sungchul Park

Sangho Kim

Seunghan Seo

Kyungwan Park

Jaegon Lee

Joonseok Kim

Byungjoon Kim

Wonseob Kim

Heejin Park

Hyunchul Hong

Chanyoul Park

Mookyung Kang

Hyongmin Lee

Jaegon Ghim

Seki Kim

Yohan Kwon

Iksu Lee

Yooseok Shon

Dooseok Yoon

Wookyeong Jeong

JaeYoung Lee

A system on chip includes a core configured to maintain a clock gating state; a plurality of header switch circuits configured to deliver a supply voltage, which is reduced from an external supply voltage, to the core in response to a plurality of control signals; and a voltage regulator configured to monitor the supply voltage, change logic levels of the plurality of control signals according to a difference level corresponding to a difference between the supply voltage and a preset target voltage, and output the plurality of control signals of which the logic levels have been changed to the plurality of header switch circuits.

System on chip for supplying a voltage

According to various embodiments, an electronic device may include a housing including a first plate, a second plate facing away from the first plate, and a side housing surrounding a space between the first plate and the second plate and joined to the second plate or provided integrally with the second plate, a display viewable through at least part of the first plate, a first Printed Circuit Board (PCB) disposed between the first plate and the second plate and including at least one first ground layer, a Flexible Printed Circuit Board (FPCB) at least partially overlapping the first PCB when viewed from above the first plate and including a first end electrically coupled to the first PCB, a second end, and at least one second ground layer, and a conductive structure comprising a conductive material disposed between the first PCB and the FPCB and electrically coupling the first ground layer and the second ground layer.

Electronic device including conductive structure connecting electrically ground layer of flexible printed circuit board and ground layer of printed circuit board

An electronic device according to various embodiments of the present disclosure can comprise: a housing including a first plate, a second plate oriented in the direction opposite to that of the first plate, and a side member surrounding the space between the first plate and the second plate; a plurality of insulating layers interposed between the first plate and the second plate; a printed circuit board in parallel to the second plate; an array of first conductive plates mounted on one layer of the printed circuit board; a second conductive plate mounted on one layer of the printed circuit board so as not to overlap the array when viewing from the top of the second plate; a wireless communication circuit electrically connected to the array and set to provide wireless communication at a frequency of 20-100 GHz; and a grip sensing circuit electrically connected to the second conductive plate. Other various embodiments can be possible.

Electronic device comprising communication device including sensing electrode

Disclosed herein is an electronic device. The electronic device may include an electronic device may comprising a housing, a first PCB disposed inside the housing, a first wireless communication circuit disposed on the first PCB to transmit and receive signals of a first frequency band, a second PCB disposed inside the housing, wherein the second PCB includes a signal line, an antenna array disposed on the second PCB, a second wireless communication circuit disposed on the second PCB to transmit and receive a signal of a second frequency band using the antenna array, and a conductive member electrically connected to the first wireless communication circuit by the signal line of the second PCB via a feed point for the conductive member.

Electronic device including antenna module

A semiconductor device include a first wrapper including a first scan flip-flop, first control flip-flops and a first pad, the first scan flip-flop receiving a first value and second values and storing the second value for determining a function of the first pad; a second wrapper including a second scan flip-flop, second control flip-flops and a second pad, the second scan flip-flop receiving the first value from the first wrapper and storing the first value for determining a function of the second pad; and an input/output controller configured to provide a shift input signal having the first and second values to the first wrapper.

Semiconductor device having input/output wrappers, and a method of controlling the wrappers

Growing community of inventors

Suwon-si, South Korea

Jongpil Lee