Samsung Electronics Co., Ltd.

Jonghyun Seok

Kyeongseon Park

Kyungsoo Kim

Jonghoon Kim

Yongsuk Kwon

Jonggeon Lee

Jeonghyeon Cho

A printed circuit board includes: a base substrate; a pad region having a plurality of pad patterns disposed on one surface of the base substrate; and a dummy region having a plurality of conductive dummy patterns separated from the plurality of pad patterns to be disposed on the one surface of the base substrate. The pad region includes a first edge region, and a second edge region disposed in a diagonal direction of the first edge region on the one surface of the base substrate. The dummy region includes a third edge region, and a fourth edge region disposed in a diagonal direction of the third edge region on the one surface of the base substrate.

Printed circuit board

A memory module includes a memory substrate including a main connector and an auxiliary connector, configured to be connected to an external device; and a plurality of memory chips mounted on at least one of a first surface or a second surface of the memory substrate, wherein the main connector is disposed on one side of the memory substrate, and the auxiliary connector is disposed on the second surface of the memory substrate.

Memory module, main board, and server device

Growing community of inventors

Seoul, South Korea

Jonghyun Seok