Samsung Electronics Co., Ltd.

Jonghwi Seo

Jinhyuk Choi

Beomsoo Hwang

Kongwoo Lee

Keonwoo Kim

Ilyoung Han

Kyusang Lee

Nohsung Kwak

Myungki Song

Jaehee Lee

Guesuk Lee

Euijin Seo

A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.

Wafer processing apparatus including EFEM and method of processing wafer

A wafer processing apparatus of an embodiment of the present disclosure may include an equipment front end module (EFEM), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. In addition, the EFEM may include an atmosphere control chamber configured to store a wafer carrier accommodating wafers, an upper air supplier configured to supply air into the atmosphere control chamber, an EFEM chamber under the atmosphere control chamber, a load lock arranged to be vertically overlapped by at least a portion of the EFEM chamber, and an EFEM arm configured to transfer the wafer carrier.

Wafer processing apparatus including equipment front end module (EFEM) and wafer processing method using the same

A semiconductor manufacturing apparatus is provided including a beam shaper arranged on a light path of a laser beam and including a plurality of mask modules. The plurality of mask modules defines a light blocking region and a light transmitting region. At least one mask module of the plurality of mask modules includes a blocking plate configured to block a portion of the laser beam, and a driver is configured to move the blocking plate.

Semiconductor manufacturing apparatus including a beam shaper for shaping a laser beam

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Suwon-si, South Korea

Jonghwi Seo