Samsung Electronics Co., Ltd.

Jongbae Jeon

Hangyu Hwang

Changsu Kim

Sangsik Na

Pranveer Singh Rathore

Rathore Pranveer Singh

Ingook Hong

Youngjin Yi

Sooyoung Kim

Donghyeon Hwang

Jongyoul Noh

Dukjin Kim

Jinhyeong Park

Youngik Son

A method for manufacturing an electronic device, according to one embodiment of the present invention, may comprise the operations of: inserting and injecting a polymeric material into a structure, which is a plate-shaped metal structure comprising a first surface and a second surface, the structure comprising: at least one opening penetrating the first surface and the second surface; and at least one recess having a first depth from the first surface and extending to have a repeating pattern selected from among a W-shape, a sawtooth shape, and a straight line shape, when viewed from above the first surface; and confirming that the recess is filled with the polymeric material. Various other embodiments are possible.

Electronic device member of metallic structure and non-metallic structure, and method for manufacturing same

An electronic device according to various embodiments of the present disclosure includes a housing including a front plate facing a first direction, a rear plate facing a second direction that is opposite to the first direction, and side members for encompassing the inner space between the front plate and the rear plate; a display shown through at least a portion of the front plate; and a middle plate positioned between the front plate and the rear plate. The middle plate can include a first portion disposed between the front plate and the side members, when viewed from the outside of the housing. The first portion can include: a first surface supporting a portion of the front plate and facing the first direction; a second surface exposed to the outside of the housing; a third surface facing a third direction that is different from the first direction and the second direction, and facing the side surface of the front plate; and a protruding part protruding in the third direction on the third surface.

Electronic device including injection structure, and injection mold structure for injection structure

A cover device according to an embodiment of the present invention, may include a first plate including a first surface and a second surface facing away from the first surface, and being substantially rectangular, the first plate including a first edge having a first length and extending in a first direction, a second edge having a second length longer than the first length and extending in a second direction orthogonal to the first direction, a third edge parallel to the first edge, having the first length, and extending in the first direction from the second edge, and a fourth edge parallel to the second edge, having the second length, and extending from the first edge in the second direction, a first sidewall perpendicular to the first surface and extending from the first edge, a second sidewall perpendicular to the first surface and the first sidewall and extending from the second edge, a third sidewall perpendicular to the first surface and the second sidewall and extending from the third edge, and a fourth sidewall perpendicular to the first surface and the third sidewall and extending from the fourth edge, wherein the first surface, the first sidewall, the second sidewall, the third sidewall and the fourth sidewall together may form a recess for receiving and holding the electronic device, and the first surface may include at least one parting line having a third length longer than the first length and shorter than the second length and extending in the second direction.

Cover device for holding electronic device

An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing in a direction opposite to that of the first plate, and a side member enclosing a space between the first plate and the second plate and formed with a method of solidifying a resin including a predetermined amount of rigidity reinforcing material injected into an injection mold and including a plurality of side surfaces, and a gate mark receiving portion formed in each of the plurality of side surfaces of the side member and configured to receive at least one gate mark according to separation of the injection mold. The gate mark receiving portion is formed by a processing portion disposed at a corresponding position inside a cavity of the injection mold.

Housing, method of producing the same, and electronic device including the same

Growing community of inventors

Suwon-si, South Korea

Jongbae Jeon