Applied Materials, Inc.

Jong Yun Kim

Roman M Mostovoy

Won Ho Sung

William Nehrer

Kim Seong Sim

Jungwon Park

Pei-Chia Chen

Embodiments described herein relate to process systems for cleaning semiconductor process chamber components. The process systems include a process chamber having process chamber components. The process chamber components include a substrate support disposed within a chamber volume of the process chamber. A gas distribution assembly faces the substrate support. A gas baffle is fluidly coupled to the gas distribution assembly. A sensor system is coupled to the process chamber and is configured to monitor at least one characteristic of the volume of the process chamber. A dynamic gas assist is fluidly coupled to the gas baffle and is communicatively coupled to the sensor.

System and method of cleaning process chamber components

Embodiments of the present disclosure relate to a shadow frame support with one or more flow controllers and a method of controlling the flow of gases through the shadow frame support. The shadow frame support includes a body coupled to walls of a chamber such that a top surface of the shadow frame support is horizontally disposed in the chamber. The body has a plurality of channels disposed therethrough. Each channel includes a flow controller. The flow controller may be adjusted in real-time to change the open ratio of the flow controller.

One-body shadow frame support with flow controller

Growing community of inventors

Hwaseong-si, South Korea

Jong Yun Kim