Dow Global Technolgoies LLC

Jong-Young Lee

Brian W Walther

Mridula Babli Kapur

Yushan Hu

Jeffrey D Weinhold

Rahul Sharma

Alyssa J Fielitz

Michelle Tsui

The present disclosure provides a composition containing a polymeric blend. The polymeric blend contains (A) from 50 wt % to 90 wt % of a first ethylene-based polymer having a density from 0.895 g/cc to 0.905 g/cc; and a melt index from 0.1 g/10 min to 50 g/10 min; (B) from 8 wt % to 48 wt % of a second ethylene-based polymer having a density from 0.935 g/cc to 0.967 g/cc; and a melt index from 0.1 g/10 min to 180 g/10 min; and from 0.01 wt % to 2.0 wt % of a slip agent, based on the total weight of the polymeric blend. The polymeric blend has (i) an overall density from 0.900 g/cc to 0.925 g/cc; and (ii) a coefficient of friction (COF) after aging for 1 week at 60&#xb0; C. from 0.001 to 0.400. The present disclosure also provides a multilayer film with a first layer containing the composition.

Low coefficient of friction ethylene-based compositions

Growing community of inventors

Lake Jackson, TX, United States of America

Jong-Young Lee