Samsung Electronics Co., Ltd.

Scatterlab Inc.

Jong Youn Kim

Dong Kyu Kim

Min Jun Bae

Jung Ho Park

Jae Gwon Jang

Yeon Ho Jang

Jin-Woo Park

Sei Ill Jeon

Jung-Ho Park

Sang Woon Jeon

Jong Su Jeon

Jang Won Kim

Tai Kyung Kim

Jung-ho Park

Gwang Jae Jeon

Yoo Jin Jung

A semiconductor package includes a first semiconductor chip and a second semiconductor chip on a substrate, a barrier layer on the first semiconductor chip and the second semiconductor chip, the barrier layer having an opening through which at least a part of the first semiconductor chip is exposed, and a heat transfer part on the barrier layer, the heat transfer part extending along an upper face of the barrier layer and filling the opening.

Semiconductor package

A semiconductor package includes a redistribution substrate having first and second surfaces opposed to each other, and including an insulation member, a plurality of redistribution layers on different levels in the insulation member, and a redistribution via having a shape narrowing from the second surface toward the first surface in a first direction; a plurality of UBM layers, each including a UBM pad on the first surface of the redistribution substrate, and a UBM via having a shape narrowing in a second direction, opposite to the first direction; and at least one semiconductor chip on the second surface of the redistribution substrate, and having a plurality of contact pads electrically connected to the redistribution layer adjacent to the second surface among the plurality of redistribution layers.

A semiconductor package includes a first semiconductor chip including a first surface and a second surface which face each other, an alignment pattern formed on the first surface, a first redistribution layer arranged on the first surface of the first semiconductor chip, a second redistribution layer arranged on the second surface of the first semiconductor chip, and electrically connected with the semiconductor chip, and a first dielectric layer including the alignment pattern between the first redistribution layer and the semiconductor chip, the alignment pattern overlapping the first surface of the first semiconductor chip.

Semiconductor package having multi-level and multi-directional shape narrowing vias

A method for analyzing emotion based upon a messenger conversation is disclosed herein. The method may include the steps of storing survey information of a user respective to a specific counterpart with whom the user wishes to analyze emotion, opening a conversation history between the user and the specific counterpart, analyzing the survey information and the conversation history, thereby analyzing the emotion between the user and the specific counterpart, and showing the emotion analysis to the user.

Method for analyzing emotion based on messenger conversation

A refrigerator including left and right doors of rotating opening/closing type and a sliding door between the left and right doors. The left and right rotating opening/closing doors have an improved slim edge structure such that a door thickness is hidden. The sliding door includes door guards to accommodate food.

Refrigerator

Shelf for refrigerator

Growing community of inventors

Seoul, South Korea

Jong Youn Kim