Samsung Electronics Co., Ltd.

Sungkyunkwan University

Jong-woon Lee

Kyoung-woo Lee

Byoung-lyong Choi

Shaofeng Ding

Eun-Kyung Lee

In-hwan Kim

Won-Jae Joo

Dong-mok Whang

Byung-Sung Kim

Jae-hyun Lee

An interposer includes a substrate having a mounting area and a test area, first conductive plugs separate from each other, the first conductive plugs being disposed along a first direction and into the test area of the substrate, a first line pattern group including first non-conductive patterns disposed on first centers of the first conductive plugs, and first conductive patterns disposed to bridge first peripheries of a first adjacent pair of the first conductive plugs, and first pads connected to the first conductive patterns at both first ends of the first line pattern group.

Interposer, method of manufacturing interposer, and method of manufacturing semiconductor package

According to example embodiments, a wire structure includes a first wire that includes a first wire core and a first carbon shell surrounding the first wire core, and a second wire that extends in a longitudinal direction from the first wire. The first wire core has a wire shape. The first carbon shell contains carbon.

Wire structure and semiconductor device having the same, and method of manufacturing the wire structure

Growing community of inventors

Suwon-si, South Korea

Jong-woon Lee