Samsung Electronics Co., Ltd.

Amkor Technology, Inc.

University-industry Cooperation Group of Kyung Hee University

Jong Wook Park

Byung Seok Min

Jae-Sung Park

Kwang Seok Oh

Byoung Youl Min

Young Kuk Park

Ju-ha Park

Dong-il Song

Tae Soo Kim

Hee Yeoul Yoo

Jicheng Yang

David DoSung Chun

Hayoon Lee

Young Hyo Eun

A display apparatus capable of correcting an image quality change caused by long-term use is provided. The display apparatus includes: a display panel; a communicator configured to communicate with a service apparatus; and a controller configured to control the communicator to transmit operation information including a total operating time of the display apparatus and an operating temperature of the display apparatus, to the service apparatus; receive an image parameter from the service apparatus through the communicator, and based on the received image parameter data; process image data; and transmit the processed image to the display panel. The image parameter may include at least one of a brightness level, a contrast, a sharpness level, and a color density of the display panel.

Display apparatus and control method thereof

A compound for an organic optoelectronic device represented by Chemical Formula 1 and an organic optoelectronic device including the same are provided.  In Chemical Formula 1,

Compounds for organic optoelectronic device and organic optoelectronic device including the same

A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is coupled to the second surface of the first semiconductor chip. A second semiconductor chip having first and second surfaces which are substantially flat in nature is further provided. An insulator is coupled to the first surface of the second semiconductor chip for preventing shorting of wirebonds. The second semiconductor chip is coupled to the adhesive layer by the insulator coupled to the first surface thereof.

Adhesive on wire stacked semiconductor package

Disclosed is a stacking structure of semiconductor chips and semiconductor package using it, capable of achieving an electric insulation even if a conductive wire makes contact with a lower surface of an upper semiconductor chip, while reducing a total thickness thereof and preventing damage. The stacking structure has a substrate formed with a plurality of circuit patterns; a first semiconductor chip bonded to an upper surface of the substrate and having a first plane and a second plane formed with a plurality of input/output pads; a spacer bonded to the second plane of the first semiconductor chip; a second semiconductor chip having first and second planes, the second plane being formed with a plurality of input/output pads, the first plane being provided with an insulating member so as to allow the second semiconductor chip to be bonded to the spacer, a first conductive wire for connecting the input/output pads of the first semiconductor chip to the circuit patterns of the substrate; and a second conductive wire for connecting the input/output pads of the second semiconductor chip to the circuit patterns of the substrate.

Method of forming a stacked semiconductor package

Disclosed is a semiconductor device and its manufacturing method. By way of example, the semiconductor device includes a semiconductor die for sensing an external physical quantity, an insulating gel covering the semiconductor die, and an encapsulant which covers the insulating gel while the insulating gel is partially exposed to the exterior. Also, another semiconductor device further includes a dummy plate which has a hole and is seated on the insulating gel. In the manufacturing method of a semiconductor device, a mold having a through hole is provided and the through hole include a structure consisting of a movable pin and a spring for absorbing the expansion of the insulating gel during an encapsulation process. Also, another manufacturing method of a semiconductor device includes performing the encapsulation while the dummy plate is seated on the insulating gel.

Encapsulated sensor device

An apparatus and method for transferring digital versatile disc (DVD) information is provided. This apparatus includes a stream format converter for providing a first stream by converting the program stream format of audio and video information read from the DVD into a transport stream format. A re-encoder is included, for providing a second stream by overlaying video information read from the disc with subpicture information read from the DVD and re-encoding the overlaid information using a predetermined compression encoding scheme for image information. A stream selector is included, for selecting either the first or second stream according to the requirements of a user, the bandwidth of a transmission channel, and the information processing capability of an apparatus for receiving information, and transferring a selected stream to the apparatus for receiving information via a transmission channel. Accordingly, information obtained using a selected optimal transfer method, that is, MPEG-2 full re-encoding, MPEG-2 I picture re-encoding, DV format re-encoding, or conversion of information stored in an original DVD into an MPEG-2 TS packet, is transferred. Therefore, even if DVD information is transferred to any apparatus, it can be viewed.

Growing community of inventors

Seoul, South Korea

Jong Wook Park