Samsung Electronics Co., Ltd.

Jong-wook Choi

Jeong-hyuck Park

Jin-sung Kim

Sung-bum Cho

Jae-Hyun Lee

Ju-hyuck Chung

Sun-hoo Park

Jang-eun Lee

Shin-woo Nam

Hee-duk Kim

Young-koo Lee

Jung-hun Cho

A process chamber used in the manufacture of a semiconductor device for etching a material layer on a semiconductor wafer includes an electrostatic chuck for holding the semiconductor wafer, and an annular edge ring which surrounds the side of the semiconductor wafer on the electrostatic chuck to prevent the semiconductor wafer from departing from its original position. The annular edge ring has a first side which faces the side of the semiconductor wafer and contacts firmly with the side of the semiconductor wafer.

Process chamber used in manufacture of semiconductor device, capable of reducing contamination by particulates

An annular ring shaped baffle plate disposed between a process chamber and a vacuum chamber of a dry etching apparatus. A plurality of slits are formed radially along the annular ring and extend from a top surface of the annular ring to a bottom surface of the annular ring. The slits are circumferentially spaced from each other, and each of the slits has an upper section that is tapered and a lower section that has a constant width. Alternatively, the slits may be replaced by a plurality of discharging regions formed in the annular ring, with the discharging regions having a circumferential width that is greater than a radial length.

Baffle plate of dry etching apparatus for manufacturing semiconductor devices

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Kyungki-do, South Korea

Jong-wook Choi