Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Jong Woo Choi

Yong Il Kwon

Tah Joon Park

Joon Seok Chae

Suk Youn Hong

Han Su Park

Hyun Kook Cho

Hyuk Ki Kwon

Hyuk Joo Yoon

An electronic component module includes a substrate; an electronic element disposed on a first surface of the substrate; an encapsulant encapsulating the electronic element; a first shielding member disposed on a first surface of the encapsulant to surround the electronic element; a second shielding member disposed on a second surface of the encapsulant and spaced apart from the first shielding member; a shielding layer covering the first shielding member and the second shielding member; and a connection member connecting the electronic element to the second shielding member.

Electronic component module

A semiconductor package includes a substrate including at least one mounted electronic device; a sealer disposed to seal the electronic device; and a conductive blocking film disposed on a surface of the sealer and a side surface of the substrate, wherein the substrate includes a spacer formed along an outer edge of a lower surface of the substrate to space the side surface of the substrate and the lower surface of the substrate to be apart from each other.

Semiconductor package and method of manufacturing the same

A fingerprint sensing device includes a board having a sensor array, a sub-board disposed on a bottom surface of the board, a circuit element disposed on the bottom surface of the board, and a through hole disposed through the sub-board, wherein the circuit element is further disposed in the through hole. A thickness of the sub-board is substantially similar to a thickness of the circuit element.

Fingerprint sensing device

Growing community of inventors

Suwon-si, South Korea

Jong Woo Choi