Samsung Electronics Co., Ltd.

Jong-Won Park

Young-Ho Park

Seog-Ho Lim

Chi-Goo Kang

Young-Kyung Kim

A light emitting device package includes a mounting substrate including first and second lower electrode portions separated by a first groove, first and second upper electrode portions separated by a second groove connected to the first groove and disposed on the first and second lower electrode portions respectively, and an insulation support member filling the first groove, a light emitting device mounted on the first and second upper electrode portions of the mounting substrate, a double phosphor film covering an upper surface of the light emitting device, including a phosphor layer and a barrier layer sequentially stacked on each other, and having a thickness of 200 &#x3bc;m or less, and a sealing member on the mounting substrate covering the light emitting device and the double phosphor film.

Growing community of inventors

Suwon-si, South Korea

Jong-Won Park