Samsung Electronics Co., Ltd.

S-printing Solution Co., Ltd.

Jong-won Han

Seong-ho Jeong

Byeong-no Jeong

Sang-jin Park

Chul-Joo Kim

Kang-Tae Kim

Doo-Hwan Kim

Eun-Young Kim

Kwang-Won Sun

Duck-hyun Kim

Jong-woo Lee

Jung-Hyeon Kim

Ji-won Moon

Jae-il Lee

Ki-jae Song

Seok Goh

Hun-Kyo Seo

Ho-Jeong Choi

Byoung-jun Min

Yong-in Lee

Hyung-seok Chang

Jong-Pil Park

Young-gi Min

Mi-so Kim

Sang-Sik Lee

Soon-won Lee

Bo-Woo Kim

A method of displaying a plurality of pages on a screen of a terminal is provided. The method includes detecting a user's gesture that requests movement of the plurality of pages, identifying a movement mode relating to the movement of the plurality of pages, and moving and displaying a first page displayed on the screen and a second page connected to the first page displayed on the screen according to the identified movement mode, wherein the movement mode is one of a discrete mode and a continuous mode.

Method and terminal for displaying a plurality of pages,method and terminal for displaying a plurality of applications being executed on terminal, and method of executing a plurality of applications

Provided are a test socket for a semiconductor device and a test device including the test socket. The test device includes a test socket including terminals arranged in a two-dimensional array and corresponding to terminals of the semiconductor device and a ground line extending along at least one row of two-dimensional array; and a substrate electrically connected to the test socket so as to transmit and receive a test signal. The test socket includes a ground line extending along at least one row of the two-dimensional array.

Test socket for semiconductor device and test device including the same

A test socket is provided that includes a base material including an insulating elastic material and a conductive portion extending through the base material in a thickness direction of the base material, wherein the conductive portion includes a plurality of conductive particle structures arranged in the thickness direction of the base material, and each of the plurality of conductive particle structures includes a plurality of conductive particles having at least one insulating wire and/or at least one conductive wire extending from a surface of the conductive particle, bonded with a material having a functional group.

Test socket for testing semiconductor chip package and method of manufacturing the same

An electrophotographic image forming apparatus may include an imaging cartridge and a toner cartridge that are detachably attached to a main body, a first optical sensor that is mounted in the imaging cartridge and detects a toner level in a development chamber, and a second optical sensor that is mounted in the toner cartridge and detects a toner level in the development chamber.

Electrophotographic image forming apparatus, toner cartridge for the same, imaging cartridge for the same, and method of controlling toner level in developing chamber of the same

Method and terminal for displaying a plurality of pages, method and terminal for displaying a plurality of applications being executed on terminal, and method of executing a plurality of applications

An electrophotographic image forming apparatus includes an imaging cartridge and a toner cartridge that are detachably attached to a main body, a first optical sensor that is mounted in the imaging cartridge and detects a toner level in a development chamber, and a second optical sensor that is mounted in the toner cartridge and detects a toner level in the development chamber.

An electrophotographic image forming apparatus and a development cartridge are provided. The electrophotographic image forming apparatus includes a body including an opening, a photoreceptor cartridge attached to, or detached from, the body through the opening, a photoconductive drum and a mounting portion, a development cartridge attached to, or detached from, the mounting portion through the opening while the photoreceptor cartridge is mounted in the body, a development roller supplying toner to an electrostatic latent image formed on the photoconductive drum, a cover for opening or closing the opening, and a pressurizing unit fixing the development cartridge to the mounting portion by providing a pressing force to the development cartridge in a direction parallel to a center line connecting centers of the photoconductive drum and development roller while the opening is closed.

Electrophotographic image forming apparatus and development cartridge

A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket.

Test socket, and test apparatus with test socket to control a temperature of an object to be tested

A connecting unit to test a semiconductor chip and an apparatus to test the semiconductor chip having the same include a plurality of connectors, on which a semiconductor chip having a certain pattern of electrical connection terminals, having a plurality of holes, cables configured to electrically connect the electrical connection terminals to the exterior, and coupling units configured to selectively electrically connect the cables to the electrical connection terminals through the holes. Therefore, it is possible to perform electrical tests of semiconductor chips having various patterns of electrical connection terminals and receive the semiconductor chips in a tray at a time.

Connecting unit to test semiconductor chips and apparatus to test semiconductor chips having the same

Growing community of inventors

Cheonan-si, South Korea

Jong-won Han