Samsung Electronics Co., Ltd.

Jong-Wan Jung

Seok-Ha Lee

Jae-seob Roh

Byung-Jun Park

Jung-Hyun Nam

Yun-Hee Lee

Duck-hyung Lee

Chang-Rok Moon

According to a CMOS image device and a method of manufacturing same, dark current is decreased by a local impurity region. The image device includes a semiconductor substrate, and a transfer gate formed on a predetermined portion of the semiconductor substrate and electrically insulated from the semiconductor substrate. A photodiode is formed in the semiconductor substrate on one side of the transfer gate, and a floating diffusion region is formed on the semiconductor substrate in the other side of the transfer gate. A local impurity region of a first conductivity type is formed to be partially overlapped the transfer gate between the photodiode and the floating diffusion region.

CMOS image device with local impurity region

A CMOS image sensor cell includes a semiconductor active region of first conductivity type having a surface thereon and a P-N junction photodiode in the active region. A drive transistor is also provided in the semiconductor active region. The drive transistor has a gate electrode that is configured to receive charge generated in the P-N junction photodiode during an image capture operation (i.e., during capture of photons received from an image). This drive transistor has a gate electrode and a contoured channel region extending underneath the gate electrode. The contoured channel region has an effective channel length greater than a length of the gate electrode.

CMOS image sensor having drive transistor with increased gate surface area and method of manufacturing the same

An image sensor may include a semiconductor substrate having a pixel array region and a logic region. A first gate electrode may be formed on the pixel array region of the semiconductor substrate. A lower electrode may be formed on a portion of the logic region of the semiconductor substrate. A first capping layer may be formed on at least a portion of the lower electrode. A dielectric layer may be formed on the first capping layer. An upper electrode may be formed on the dielectric layer. The first gate electrode and the lower electrode may include a polysilicon layer, and the first capping layer may include at least one of a metal layer and a metal silicide layer.

Image sensor and method of fabricating the same

An image sensor and a method of fabricating the image sensor are provided. The image sensor includes a semiconductor substrate having a first conductivity type, a deep well having a second conductivity type. The deep well is formed at a predetermined depth in the semiconductor substrate to divide the semiconductor substrate into a first conductivity type upper substrate area and a lower substrate area. The image sensor further includes a plurality of unit pixels integrating charges corresponding to incident light and comprising first conductivity type ion-implantation areas. The first conductivity type ion-implantation areas are separated from one another. Moreover, at least one unit pixel among the plurality of unit pixels further comprises the first conductivity type upper substrate area that is positioned under a first conductivity type ion-implantation area included in the unit pixel. Further, the at least one unit pixel among the plurality of unit pixels extends beyond the first conductivity type ion-implantation area and is electrically isolated from first conductivity type ion-implantation areas included in adjacent unit pixels of the plurality of unit pixels.

Image sensing device for reducing pixel-to-pixel crosstalk

An image sensor is provided. The image sensor includes a substrate; a first isolation region, a second isolation region, a plurality of photoelectric transducer devices, a read element and a floating diffusion region. The second isolation region has a depth that is less than that of the first isolation region. The plurality of photoelectric transducer devices is isolated from one another by the first isolation region. The read element and the floating diffusion region are isolated from the photoelectric transducer devices by the second isolation region.

Growing community of inventors

Gyeonggi-do, South Korea

Jong-Wan Jung