Samsung Electronics Co., Ltd.

Jong-sup Song

Seol-young Choi

Ji-hoon Yun

Won-soo Ji

Ho-Young Song

Kyung-wook Hwang

Sang-woo Ha

Chi-Goo Kang

Min-gyeong Gwon

Sae-sil Kim

Eun-joo Shin

Sun-Woo Kim

Yu-ri Jung

Seung-gyun Jung

A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.

Light-emitting device package including a lead frame

A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device.

Packaged light emitting devices including electrode isolation structures and methods of forming packaged light emitting devices including the same

Light emitting device package including a lead frame

There are provided a lighting lens, a lighting lens array, and a lighting apparatus. The lighting lens may include an incidence part to receive light from a light source and an emission part to emit light provided from the incidence part. The incidence part may have a concave region that contains a light source and a first protrusion at a rear side of the light source that protrudes downwards from a top surface of the concave region. The emission part may include a dome-shaped part that encloses the incidence part and a second protrusion at the rear side of the light source that protrudes upwards from a top surface of the dome-shaped part. A lowermost portion of the emission part may be formed at a first plane, and an angle between an outer surface of the emission part and the first plane is an obtuse angle.

Asymmetric lighting lens, lighting lens array, and lighting apparatus therewith

A light-emitting device includes a light-emitting structure, a lens, and a reflective layer. The light-emitting structure includes a light-emitting stack structure including a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer, which are stacked, a first electrode layer electrically connected to the first-conductivity-type semiconductor layer, and a second electrode layer electrically connected to the second-conductivity-type semiconductor layer. The lens is located on the light-emitting structure. The reflective layer is located on the lens.

Light-emitting device including chip-scale lens

Growing community of inventors

Hwaseong-si, South Korea

Jong-sup Song