Samsung Medison Co., Ltd.

Jong-Sun Ko

Yong Jae Kim

Hyun Phill Ko

Ki Soo Kim

Jong Mok Lee

Won Hee Lee

Jinwoo Jung

Jisu Kim

Jin Woo Jung

Kyung Min Lee

Ji Su Kim

Jin Hwan Park

In Seong Song

Jae-Yk Kim

Joonghyun Park

Saidmurod Akramov

Joong Hyun Park

Seung Hyun Kim

Kwangjin Son

Youngmon Cho

Jee Rak Choi

Yoon Sung Kyung

Disclosed are an ultrasonic probe and a method of manufacturing the same. The ultrasonic probe includes a piezoelectric layer including one or more kerfs such that piezoelectric elements are provided in a plurality of rows along an elevation direction, a first electrode formed on an upper side of the piezoelectric layer, a second electrode formed on a lower side of the piezoelectric layer, a matching layer disposed above the piezoelectric layer and including one or more grooves connected to the one or more kerfs, and a third electrode formed in inner surfaces of the one or more grooves and electrically connected to the first electrode.

Ultrasonic probe and method of manufacturing the same

An ultrasonic includes: a piezoelectric layer; an absorbing layer disposed at a lower portion of the piezoelectric layer, configured to absorb an acoustic signal; and a connection part disposed between the piezoelectric layer and the absorbing layer. The connection part may deform at least partially so that a plurality of acoustic signals radiated from the piezoelectric layer due to the connection part have different magnitudes. In the case of the ultrasonic probe, since the magnitude of the acoustic energy radiated from the center of the ultrasonic probe is larger than the magnitude of the acoustic energy radiated from the side of the ultrasonic probe, the directivity of the ultrasonic signal is improved and a side lobe is decreased. In addition, an apodization effect capable of suppressing overlapping between adjacent phases can be obtained by using a difference in the magnitude of the acoustic energy to be radiated.

Ultrasonic probe

Disclosed herein is an ultrasonic probe including a piezoelectric layer, a matching layer disposed at an upper portion of the piezoelectric layer, a conductive member disposed at a lower portion of the piezoelectric layer, a second connector coupled to at least one side of the conductive member, and a printed circuit board coupled to a side of the second connector and electrically coupled to the second connector. A printed circuit board is disposed outside a laminated structure of the acoustic element so that the printed circuit board can be prevented from affecting acoustic characteristics of the ultrasonic probe, a failure in a process of manufacturing the ultrasonic probe that occurs due to a change in temperature or humidity can be prevented, and the manufacturing process can be relatively simplified.

A probe includes: a piezoelectric layer to generate ultrasonic waves, a backing layer to absorb ultrasonic waves generated at the piezoelectric layer and proceeding toward a rear, a reflective layer occupying an area smaller than an area of the piezoelectric layer and provided in between the piezoelectric layer and the backing layer to amplify the ultrasonic waves generated at the piezoelectric layer, and a lens layer to focus the ultrasonic waves proceeding toward a front of the piezoelectric layer at a certain point.

Probe and manufacturing method thereof

Disclosed herein is a probe including: an acoustic module including a piezoelectric layer configured to generate ultrasonic waves, a matching layer configured to reduce a difference in acoustic impedance between the piezoelectric layer and an object, and a backing layer configured to absorb ultrasonic waves generated by the piezoelectric layer and transmitted backward from the piezoelectric layer; a plurality of attenuation layers provided at both edges of the upper surface of the acoustic module, and configured to attenuate ultrasonic waves generated by the acoustic module; and a lens layer disposed to cover the upper surfaces of the attenuation layers, and configured to focus ultrasonic waves transmitted forward from the piezoelectric layer at a predetermined point.

Growing community of inventors

Seoul, South Korea

Jong-Sun Ko