Mk Electron Co., Ltd.

Jong Soo Cho

Yong Jin Park

Kyu Hwan Oh

Jeong Tak Moon

Sung Jae Hong

Eun Kyu Her

A gold-silver based wire for a semiconductor package has high humidity reliability as well as high dry reliability. The wire includes a first additive ingredient that contains 5&#x2dc;15 wt % of at least one kind of elements from among first group elements composed of palladium (Pd) and platinum (Pt) added to a gold (Au)-silver (Ag) based alloy that contains 10&#x2dc;40 wt % of Ag added to Au.

Au-Ag based alloy wire for semiconductor package

A gold (Au) alloy bonding wire for a semiconductor device is provided. The Au alloy bonding wire is manufactured by adding at least one of polonium (Po), promethium (Pm), thulium (Tm), and boron (B) to high-purity gold of 99.999% or more in an amount of 3&#x2013;30 parts per million (ppm) by weight and at least one of magnesium (Mg), sodium (Na), vanadium (V), molybdenum (Mo), and technetium (Tc) in an amount of 3&#x2013;30 ppm by weight to the high-purity gold. In the Au alloy bonding wire, high-temperature reliability after ball bonding is not reduced and damage near a ball neck in forming an ultra low loop of the Au alloy bonding wire can be prevented.

Growing community of inventors

Seoul, South Korea

Jong Soo Cho