Samsung Electronics Co., Ltd.

Jong-rak Sohn

Dong-Min Kim

Seok-chan Lee

Jae-bum Lee

Ki-Sun Kim

Il-woo Park

Ju-seok Lee

Disclosed are a card socket device and an electronic apparatus including the same. The card socket device includes a seat portion configured to receive an attachable card; and one or more connection terminal portions formed in the seat portion and configured to form an electrical connection with one or more connection pads formed in a bottom surface of the attachable card, wherein the seat portion is configured such that a space accommodating the attachable card is upwardly opened.

Card socket device and electronic apparatus including the same

A method of manufacturing a light-emitting diode package is illustrated. A light-emitting diode chip is manufactured. A material layer is formed on side surfaces and a rear surface of the light-emitting diode chip. The material layer is then oxidized to convert the material layer into an oxidized layer to form a reflective layer on the side surfaces and the rear surface of the light-emitting diode chip. The light-emitting diode chip is packaged.

Method of manufacturing light-emitting diode package

Growing community of inventors

Hwaseong-si, South Korea

Jong-rak Sohn