Samsung Electro-Mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Ja Hwa Electronics Co., Ltd.

Jong Pil Lee

Seung Mo Lim

Taek Jung Lee

Jin Kyung Joo

Seung Woo Song

Ji Hyun Park

Sung Kwon An

Jong Bong Lim

Hyo Youn Lee

Sung Wook Kim

Katsushi Yasuda

Hai Joon Lee

Young Key Kim

Jang Ho Park

Je Hong Kyoung

In Young Kang

Doo Sik Shin

Ho Phil Jung

Jin Soo Seol

Jung Il Kim

Byung Cheol Lee

Doo Ho Yoo

Jong Beom Jeon

Hyun Jun Choi

Hyung Seok Roh

Hyung Gon Kim

Jung Woo Kim

Dong Woo Lee

Jin Man Jung

Min Ho Kim

Sung Chul Park

Tae Joon Park

Sung Min Lee

Kyo Yeol Lee

Dong Joon Oh

Hae In Kim

Jae Sang Lee

Ichiro Tanaka

Jong Tae Kim

Sang Yeob Cha

Su Rim Bae

Eun Ju Oh

Hee Young Jun

Soon Bum Lee

Shin Woong Bang

Se Young Seo

An interposer includes an interposer body; first and second lower patterns spaced apart from each other on a lower surface of the interposer body; and first and second upper patterns spaced apart from each other on an upper surface of the interposer body. The first and second upper patterns include first and second shape-securing layers spaced apart from each other on the upper surface of the interposer body, and first and second acoustic noise reduction layers disposed on the first and second shape-securing layers, respectively. An electronic component includes a capacitor and the interposer.

Interposer and electronic component including the same

An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

Electronic component and manufacturing method thereof

A multilayer capacitor includes: a first internal electrode layer including first and second internal electrodes disposed to face each other with an insulating portion interposed therebetween; a second internal electrode layer including a third internal electrode and a lead portion connected to the third internal electrode; a body including the first and second internal electrode layers alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively; and a third external electrode disposed on the body to be connected to the lead portion.

Multilayer capacitor

An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

A multilayer capacitor includes: a first internal electrode layer including first and second internal electrodes spaced apart from each other with an insulating portion interposed therebetween; a second internal electrode layer including a third internal electrode; a body including the first and second internal electrode layers alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes disposed on the body to be electrically connected to the first and second internal electrodes, respectively; a connection electrode penetrating through the body to thereby be electrically connected to the third internal electrode; and a third external electrode disposed on the body to be electrically connected to the connection electrode.

A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to a mounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.

Multilayer capacitor and board having the same

There is provided a piezoelectric vibration member including: a vibration substrate including a vibrating portion and a surrounding portion which is thinner than the vibrating portion; and vibrating electrodes disposed on one surface and the other surface of the vibrating portion in a thickness direction, wherein the vibrating portion includes protrusion portions protruding in relation to one surface and the other surface of the surrounding portion in the thickness direction, and at least one side surface of the protrusion portion has two or more crystal planes.

Piezoelectric vibration member, method of manufacturing the same, and piezoelectric vibrator

A monolayer thin film capacitor includes: a bottom electrode; a top electrode; a dielectric layer disposed between the bottom electrode and the top electrode; a first via formed in the dielectric layer so as to penetrate through the dielectric layer; a second via formed in the top electrode so as to penetrate through the top electrode and having a greater width or a greater diameter than that of the first via; and a connection electrode disposed on inner sides of the first and second vias, electrically connected to the bottom electrode, and electrically insulated from the top electrode.

Monolayer thin film capacitor and method for manufacturing the same

A resistor element includes a substrate having first and second surfaces facing each other, and a plurality of side surfaces connecting the first surface and the second surface with each other. A resistance layer is on at least one of the first and second surfaces. A first terminal and a second terminal are connected to the resistance layer, and each include a first electrode layer on the first surface, a second electrode layer on the second surface, and a plurality of side electrode layers on at least a portion of the plurality of side surfaces. At least a portion of the side surfaces of the substrate is exposed between side electrode layers of the first terminal.

Resistor element

A multilayer ceramic capacitor includes: a capacitance layer including dielectric layers and first and second internal electrodes disposed with respective dielectric layers interposed therebetween; a protection layer disposed on one surface of the capacitance layer; an alpha connection electrode provided in an alpha via penetrating through the protection layer; and a beta connection electrode provided in a beta via penetrating through the capacitance layer and connected to the alpha via. The alpha via has a diameter greater than that of the beta via.

Multilayer ceramic capacitor and method for manufacturing the same

A piezoelectric oscillator, and method of making the same, includes an oscillation substrate comprising an oscillating part and a surrounding part, wherein the surrounding part is thinner than the oscillating part, and oscillating electrodes disposed on an upper surface and a lower surface of the oscillating part. The oscillation substrate is configured according to H=400.59&#xd7;S+1.75&#xb1;1.5, wherein H=100&#xd7;(T/T) and S=T/(L&#x2212;L), wherein Lrepresents an entire length of the oscillation substrate, Lrepresents a length of the oscillating part, Trepresents a thickness of the oscillating part, and Trepresents a step height between the oscillating part and the surrounding part.

Piezoelectric oscillator and method of making the same

A crystal oscillator package includes a crystal piece configured to vibrate in response to an electrical signal, a first vibrating part protruding from an upper surface of the crystal piece, a second vibrating part protruding from a lower surface of the crystal piece, a first exciting electrode disposed on the first vibrating part, a second exciting electrode disposed on the second vibrating part, and protrusions extending from an end portion of the lower surface of the crystal piece. The protrusions include two or more stages.

Crystal oscillator package

A piezoelectric device package may include: a case having a plurality of terminals formed on a lower surface thereof; a piezoelectric device formed in the case; a temperature measuring device formed on the lower surface of the case and having a thin film form; and a cover member enclosing an upper portion of the case.

Piezoelectric device package and method of fabricating the same

Monolayer thin film capacitor

Growing community of inventors

Suwon-si, South Korea

Jong Pil Lee