Samsung Display Co., Ltd.

Philoptics Co., Ltd

Jong Nam Moon

Tae Yong Kim

Gyoo Wan Han

Je Kil Ryu

Il Young Jeong

Cheol Lae Roh

Tae Hyoung Cho

Jeong Hun Woo

Ki Su Han

A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

Method for cutting substrate

Growing community of inventors

Suwon-si, South Korea

Jong Nam Moon