Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Hyundai Motor Company

Korea Institute of Science and Technology

Jong Myeon Lee

Beom Joon Cho

Ho Sung Choo

Myung Whun Chang

Youn Gon Park

Hai Sung Lee

Seung Hyun Ra

Soo Hyun Lyoo

Young Hee Lee

Kay Hyeok An

Sang Moon Lee

Hyun Jun Kim

Jae Jun Ko

In Hwan Oh

Heung Yong Ha

Ki Young Lee

Won Ha Moon

Tae Won Lim

Seong-Ahn Hong

Eun Tae Park

Hyun Chul Jung

Yun Hwi Park

Chang Hoon Choi

Dong Woohn Kim

Soo Whan Kim

Min Ji Ko

Hyoung Dong Kang

There is provided a Low Temperature Co-fired Ceramic (LTCC) composition, an LTCC substrate comprising the same, and a method of manufacturing the same. The LTCC composition includes 20 to 70 parts by weight of ceramic powder; and 30 to 80 parts by weight of glass component for low-temperature sintering, wherein the ceramic powder has plate-shaped ceramic powder particles and globular ceramic powder particles, and the ceramic powder has a content ratio of the globular ceramic powder particles with respect to the plate-shaped ceramic powder particles in a range of 0 to 1.

LTCC composition, LTCC substrate comprising the same and method of manufacturing the same

A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.

Method of manufacturing light emitting diode package

An LED package comprises a frame having a concave portion formed in the center thereof; one or more LED chips mounted on the bottom surface of the concave portion; and a lens filled in the concave portion, the lens having an upper surface formed of continuous prismatic irregularities forming concentric circles.

Light emitting diode package and method of manufacturing the same

The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.

Method of forming phosphor film and method of manufacturing light emitting diode package incorporating the same

Provided is a laminated ceramic package. The laminated ceramic package includes a laminated ceramic substrate having a conductive pattern therein, a first ceramic layer on the laminated ceramic substrate, and a second ceramic layer on the first ceramic layer. The first ceramic layer has a firing area shrinkage rate of about 1% or less. The second ceramic layer has a cavity receiving electronic components and a different firing shrinkage rate from the first ceramic layer.

Laminated ceramic package

Provided are a constraining green sheet and a method of manufacturing a multi-layer ceramic substrate. The constraining green sheet includes a first constraining layer and a second constraining layer. The first constraining layer has a side to be disposed on a multi-layer ceramic laminated structure and is formed of a first inorganic powder having a first particle diameter. The second constraining layer is disposed on top of the first constraining layer and is formed of a second inorganic powder having a second particle diameter larger than the first particle diameter. The second constraining layer is equal to or lower than the first constraining layer in terms of powder packing density. A shrinkage suppression rate can be increased and a de-binder passage can be secured in a firing process of the ceramic laminated structure by using the constraining green sheet formed of inorganic powders having different density and particle diameter.

Constraining green sheet and method of manufacturing multi-layer ceramic substrate using the same

Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBiO-bBO-cSiO-dBaO-eTiO, where a+b+c+d+e=100, and a, b, c, d, and e are 40&#x2266;a&#x2266;89, 10&#x2266;b&#x2266;50, 1&#x2266;c&#x2266;20, 0&#x2266;d&#x2266;10, and 0&#x2266;e&#x2266;10, respectively.

Glass composition, dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same

The present invention provides a field emitter electrode and a method for fabricating the same. The method comprises the steps of mixing a carbonizable polymer, carbon nanotubes and a solvent to prepare a carbon nanotube-containing polymer solution, electrospinning (or electrostatic spinning) the polymer solution to form a nanofiber web layer on a substrate, stabilizing the nanofiber web layer such that the polymer present in the nanofiber web layer is crosslinked, and carbonizing the nanofiber web layer such that the crosslinked polymer is converted to a carbon fiber.

Carbon-fiber web structure type field emitter electrode and fabrication method of the same

Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiOof about 80 wt % or more, and an accessory component, CuBiOand ZnO&#x2014;BO&#x2014;SiO-based glass of about 20 wt % or less.

Dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same

There is provided a hard-to-sinter constraining green sheet and a method of manufacturing a multilayer ceramic substrate using the same. The hard-to-sinter constraining green sheet disposed at least one of top and bottom surfaces of a non-sintered multi-layer ceramic substrate, the hard-to-sinter constraining green sheet including: a first constraining layer having a surface to be positioned on the multi-layer ceramic substrate, the first constraining layer including a first organic binder and a first inorganic powder having a spherical shape or a quasi-spherical shape; and a second constraining layer bonded to a top surface of the first constraining layer and including a second organic binder and a second inorganic powder having a flake shape, the second constraining layer having a powder packing density lower than that of the first constraining layer.

Constraining green sheet and manufacturing method of multi-layer ceramic substrate

There is provided a constraining green including a first constraining layer having a surface disposed on the one of the top and bottom surfaces of the ceramic laminated body, the first constraining layer containing a first inorganic powder; and a second constraining layer disposed on a top of the first constraining layer and containing a second inorganic powder and a fly ash. The constraining green sheet serves to ensure less shrinkage of the ceramic laminated body and improve debinding characteristics.

Constraining green sheet and manufacturing method of multi-layer ceramic substrate using the same

A process for fabricating a field emitter electrode includes: impregnating a cathode and anode in an electrolyte containing carbon nanotubes dispersed therein and applying a predetermined voltage to the cathode and anode so as to deposit carbon nanotubes on a substrate provided on the anode; recovering the substrate and applying a conductive polymer onto the surface of the substrate having carbon nanotubes deposited thereon; and heat treating the conductive polymer having carbon nanotubes deposited thereon, so as to completely cure it.

Process for fabricating a field emitter electrode with carbon nanotubes

Fabrication method of carbon-fiber web structure type field emitter electrode

A light emitting diode package with reduced light loss includes a package substrate, a light emitting diode chip mounted on the package substrate and an encapsulant formed on the package substrate to encapsulate the light emitting diode chip. The encapsulant has a refractive index gradient with refractive indices continuously increasing from a peripheral surface thereof to a central axis thereof.

Growing community of inventors

Gyunggi-do, South Korea

Jong Myeon Lee