Samsung Medison Co., Ltd.

Jong Mok Lee

Hyun Phill Ko

Ki Soo Kim

Jong-Sun Ko

Jin Ho Gu

In Seong Song

Yong Jae Kim

Jae-Yk Kim

Saidmurod Akramov

Young Mun Cho

An ultrasonic probe includes a connection layer including a conductor array for connecting a transducer array and a printed circuit board (PCB) to an application specific integrated circuit (ASIC). The ultrasonic probe includes a transducer array which transmits and receives an ultrasonic wave, a first electronic circuit electrically connected to the transducer array, a second electronic circuit electrically connected to the first electronic circuit, and a connection layer disposed between the transducer array and the first electronic circuit and including a first conductor array in contact with the transducer array so that the transducer array is electrically connected to the first electronic circuit and a second conductor array in contact with the second electronic circuit so that the second electronic circuit is electrically connected to the first electronic circuit.

Ultrasonic probe and method of manufacturing the same

A probe includes: a piezoelectric layer to generate ultrasonic waves, a backing layer to absorb ultrasonic waves generated at the piezoelectric layer and proceeding toward a rear, a reflective layer occupying an area smaller than an area of the piezoelectric layer and provided in between the piezoelectric layer and the backing layer to amplify the ultrasonic waves generated at the piezoelectric layer, and a lens layer to focus the ultrasonic waves proceeding toward a front of the piezoelectric layer at a certain point.

Probe and manufacturing method thereof

Disclosed herein is a probe including: an acoustic module including a piezoelectric layer configured to generate ultrasonic waves, a matching layer configured to reduce a difference in acoustic impedance between the piezoelectric layer and an object, and a backing layer configured to absorb ultrasonic waves generated by the piezoelectric layer and transmitted backward from the piezoelectric layer; a plurality of attenuation layers provided at both edges of the upper surface of the acoustic module, and configured to attenuate ultrasonic waves generated by the acoustic module; and a lens layer disposed to cover the upper surfaces of the attenuation layers, and configured to focus ultrasonic waves transmitted forward from the piezoelectric layer at a predetermined point.

Growing community of inventors

Yongin-si, South Korea

Jong Mok Lee