Samsung Electro-Mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Jong Man Kim

Young Hoon Kwak

Young Ho Sohn

Han Bit Kim

Jin Su Kim

Kyung Ho Lee

Young Ki Lee

Kee Ju Um

Kyu Hwan Oh

Si Joong Yang

Tae Hyun Kim

Seog Moon Choi

Dong Hwan Kim

Seok Hwan Kim

Jae Hyun Lim

Hyo Jin Lee

Chul Kyu Kim

Tae Hoon Kim

Young Bok Yoon

Kang Heon Hur

Sung Han Kim

Ju Ho Kim

Sang Kyu Lee

Kyu Bum Han

Jin Suk Son

Tae Ho Yun

Chang Jae Heo

Chang Seob Hong

Soon Gyu Yim

Eun Seok Kim

Min Gyu Park

Joon Hyung Cho

Kyu Kwan Oh

Jong Gil Won

An optical assembly includes: a camera module; at least one actuator configured to move the camera module; and a connection substrate having one end connected to the camera module such that at least a portion of the connection substrate is configured to move along with movement of the camera module. The connection substrate includes a rigidity reduction portion reducing rigidity of the connection substrate in a portion of the substrate in which distortion or warpage occurs according to the movement of the camera module.

Optical assembly

A semiconductor package includes a wiring portion including an insulating layer, conductive patterns disposed on the insulating layer, and conductive vias penetrating through the insulating layer and connected to the conductive patterns, a semiconductor chip disposed on the wiring portion, an encapsulant disposed on the wiring portion and encapsulating at least a portion of the semiconductor chip, and a metal layer disposed on the semiconductor chip and the encapsulant and having a thickness of 10 &#x3bc;m to 70 &#x3bc;m.

Fan-out semiconductor package

A fan-out sensor package includes: a core member including a wiring layer including a plurality of layers and having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole; an encapsulant encapsulating at least portions of the core member and the IC for a sensor; and a connection member disposed on the core member and the IC for a sensor and including a plurality of circuit layers, wherein the circuit layer includes sensing patterns detecting a change in capacitance.

Fan-out sensor package

A fan-out semiconductor package includes a wiring portion, semiconductor chips, a dummy chip, and an encapsulant. The wiring portion includes an insulating layer, conductive patterns formed on the insulating layer, and conductive vias penetrating through the insulating layer and connected to the conductive patterns. The semiconductor chips are disposed on one region of the wiring portion, and the dummy chip is disposed on another region thereof and has a thickness smaller than those of the semiconductor chips. The encapsulant encapsulates at least portions of the semiconductor chips and the dummy chip. An upper surface of the wiring portion is disposed below a center line of the fan-out semiconductor package, and the thickness t of the dummy chip is such that T/2&#x2264;t&#x2264;3T/2 in which T is a distance from the upper surface of the wiring portion to the center line of the fan-out semiconductor package.

Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one surface of the first substrate; a third substrate contacting one side of the other surface of the first substrate; a first lead frame contacting the other side of the other surface of the first substrate; and a second lead frame electrically connected to the third substrate.

Power module package

Semiconductor device

Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage; first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein.

Heat dissipation system for power module

Disclosed herein is a semiconductor package, including: a first heat radiating plate; a second heat radiating plate formed below the first heat radiating plate; a heat radiating lead formed above the first heat radiating plate and having both ends contacted with the second heat radiating plate; an insulating layer formed above the heat radiating lead; at least one power device formed above the insulating layer; and at least one control device formed above the insulating layer.

Semiconductor package

Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.

Semiconductor package substrate

Power semiconductor module

Disclosed herein is a transformer having a heat radiation function. The transformer includes a pair of cores having an E-shape and facing and contacting each other to form central pillars and outer peripheral parts, a transforming coil part wound on the central pillars of the pair of cores and dropping voltage, and a heat radiation pipe formed to have a cylindrical shape and positioned inward from the transforming coil part to radiate heat generated from the transforming coil part, thereby well discharging heat generated from the coil.

Transformer having the heat radiation function

Growing community of inventors

Gyunggi-do, South Korea

Jong Man Kim