Skhynix Inc.

Jong Kyu Moon

Jong Hoon Kim

Jong Won Kim

Wan Choon Park

Sung Su Park

Song Na

Kyung Beom Seo

Jae Yeong Jung

Jong Hyock Park

A semiconductor die pickup apparatus according to an aspect of the present disclosure includes a tape peeler for peeling a mount tape from a semiconductor die, and a flipper for holding the semiconductor die, wherein the tape peeler includes a housing part having a groove that faces the mount tape, a cover part covering the groove, a roller part connected to the cover part, and a vacuum part performing vacuum suction within the groove. The roller part moves to wind the cover part.

Semiconductor die pickup apparatus

Disclosed is a method for fabricating a semiconductor package. A mold press with upper and lower chases is used. A molded underfill (MUF) material is dispensed on a bottom surface of a mold cavity to form a first dispensed pattern with a serpentine shape. A base substrate on which die stacks are mounted is loaded on the upper chase. The mold cavity in which the die stacks are inserted is closed and MUF material flows between the die stacks to impregnate the die stacks.

Methods for fabricating semiconductor packages by using a mold press with an upper chase and a lower chase

Semiconductor devices are provided. The semiconductor device includes a semiconductor layer having a first surface and a second surface that are opposite each other, a through electrode penetrating the semiconductor layer and having a protrusion that protrudes over the second surface of the semiconductor layer, a front-side bump disposed over the first surface of the semiconductor layer and electrically coupled to the through electrode, a polymer pattern disposed over the second surface of the semiconductor layer to enclose a part of the protrusion of the through electrode, and a back-side bump covering an upper surface and a sidewall of a remaining part of the protrusion of the through electrode and extending over a portion of the polymer pattern.

Semiconductor devices having through electrodes and methods of manufacturing the same

A semiconductor package may include a first semiconductor die, external connectors, second semiconductor dies, a mold layer, an outer packaging part, and a terrace-like edge. The external connectors may be disposed over a first surface of the first semiconductor die. The second semiconductor dies may be stacked over a second surface of the first semiconductor die. The mold layer may cover sidewalls of the second semiconductor dies. The outer packaging part may have a groove in which a stack structure of the first and second semiconductor dies are accommodated. The terrace-like edge may be disposed under an edge of the mold layer to expose a sidewall of the first semiconductor die. A portion of an outer sidewall of the mold layer may be in contact with a portion of an inner surface of the outer packaging part, and the inner surface of the outer packaging part may be spaced apart from the sidewall of the first semiconductor die by the terrace-like edge.

Growing community of inventors

Icheon, South Korea

Jong Kyu Moon