Samsung Electronics Co., Ltd.

Jong Kyu Choi

Dong Hee Kim

Young San Kang

Sung Oh Huh

Jong Yeol Park

Soo-Hyeong Kim

A memory storage device that performs real-time monitoring is provided. The memory storage device comprises a memory controller, and a status indicating module/circuit, wherein the memory controller is configured to perform a first a second initialization operation, the first and second initialization operations performed in response to turning-on of the memory storage device, to generate a first status parameter regarding a status of the memory storage device in which the first initialization operation is performed, and to generate a second status parameter regarding the status of the memory storage device in which a second initialization operation is performed. The status indicating circuit includes a first transistor configured to operate on the basis of the first status parameter, a first resistor connected to the first transistor, a second transistor configured to operate on the basis of the second status parameter, and a second resistor connected to the second transistor.

Memory storage device, an operation method of the memory storage device, test method and electronic device

A semiconductor chip capable of improving signal quality includes a host device, a first memory device which is spaced part from the host device and connected to the host device, a repeater module which is connected to the host device and the first memory device, and a second memory device which is spaced apart from the host device and connected to the repeater module. The first memory device receives a data signal from the host device and generates a recovery clock signal, using the data signal. The repeater module receives the recovery clock signal from the first memory device, receives a first input signal from the host device, and samples the first input signal on the basis of the recovery clock signal to generate a sampling signal. The second memory device receives the sampling signal.

Semiconductor chip and vehicle comprising the same

A surface mount semiconductor package having a novel lead configuration which facilitates a higher packing density than presently available semiconductor packages. More particularly, the package includes a plurality of electrical leads each having a laterally outwardly extending portion, a downwardly extending portion depending from an inner distal end of the laterally extending portion, and a foot portion extending laterally inwardly from a lower distal end of the downwardly extending portion. A semiconductor chip is mounted, preferably by adhesive means such as insulating tape, to the foot portion of the leads. A plurality of electrical wires are connected between an upper surface of the chip and the laterally outwardly extending portion of respective ones of the leads. A protective body, such as a molded resin body, encapsulates the chip, the wires, the laterally outwardly and downwardly extending portions of the leads. The foot portion of each of the leads is at least partially disposed externally to the molded resin body to facilitate the mounting of the package to a printed circuit board (PCB) or other substrate.

Growing community of inventors

Incheon, South Korea

Jong Kyu Choi