Seoul Semiconductor Co., Ltd.

Hyundai Motor Company

Kia Motors Corporation

Yonsei University

Jong Kook Lee

Seong Jin Lee

Jae Hyun Park

Jin Woo Kwak

Byung Wook Kim

In Woong Lyo

Hyuck Jung Choi

Han Saem Lee

Kyung Nam Kim

Hyun Min Kang

Byoung Ki Pyo

Won Cho

Jun Myung Song

Jae Young Choi

Woo Young Lee

Hoon Mo Park

Byung Ho Min

Jun Ho Jang

Kyong Hwa Song

Seok Jin Kang

Hoo Dam Lee

Kyung Moon Lee

Gyung Bok Kim

Do Hyung Kim

Won Hee Cho

Gwan Sik Kim

Kwang Bea Lim

Shin Hu Cho

Hwi Jong Lee

A lighting device includes a substrate having a plurality of flat portions and a non-flat portion disposed between the flat portions, a plurality of light emitting sources disposed on the substrate, a fluorescent substrate layer covering one or more light emitting sources and converting a wavelength of a light from the light emitting source, and a connection line disposed on the substrate and electrically connecting the light emitting sources adjacent to each other between the adjacent light emitting sources. The substrate has a first end and a second end are arranged at different distance from a central axis.

Bulb-type light source

A light emitting device filament includes a substrate, a plurality of light emitting diodes, two electrode pads, and a plurality of connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extending in a first direction and having a width in a second direction. The plurality of light emitting diodes is disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The plurality of connection lines electrically connects the plurality of light emitting diodes and the two electrode pads. The plurality of connection lines includes a first connection line and a second connection line. The first connection line, the second connection line, or both are formed in a direction inclined or curved with respect to the first direction or the second direction.

Lighting-emitting device filament including electrode pads

A lighting device including at least one light emitter to emit blue light, a green phosphor having an emission peak in a range of 500 nm to 550 nm, a yellow phosphor having an emission peak in a range of 550 nm to 600 nm, and a red phosphor having an emission peak in a range of 600 nm to 650 nm, in which the yellow phosphor and the red phosphor have different full widths at half maximum, and the full width at half maximum of the yellow phosphor is longer than that of the red phosphor, and, in an emission spectrum, an intensity of light emitted from the lighting device increases from 500 nm to 600 nm, and the intensity of light emitted from the lighting device at 700 nm is less than about 10% of the maximum intensity of light emitted from the lighting device.

LED lighting apparatus having improved color rendering and LED filament

A light emitting device including a first light source including a plurality of first light emitting structures and a first wavelength converter and configured to emit a first light, a second light source including a second light emitting structure and a second wavelength converter and configured to emit a second light, and a resistor member connected to the first light source and configured to distribute current to the first light emitting structures, in which a color temperature of the first light is configured to be higher than that of the second light, and the first light and second light are configured to have different light intensity.

LED package set and LED bulb including same

A lighting apparatus including at least one light emitting diode (LED) chip configured to emit blue light; a green phosphor having a light emission peak in a range of 500 nm to 550 nm; and a red phosphor having a light emission peak in a range of 600 nm to 650 nm, in which the red phosphor includes a first red phosphor having a light emission peak in a range of 620 nm to 630 nm and a second red phosphor having a light emission peak in a range of 630 nm to 640 nm, and the full widths at half maximum of the first and second red phosphors are in a range of 20 nm to 60 nm, respectively.

LED lighting apparatus having improved color lendering and LED filament

Lighting-emitting device filament

A light emitting device filament includes a substrate, light emitting device chips, two electrode pads, and connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extends in a first direction and has a width in a second direction. The light emitting device chips are disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The connection lines electrically connect the light emitting device chips and the electrode pads. At least one of the connection lines includes a first portion extending in the first direction and a second portion extending in the second direction.

An LED package set including a substrate, a first LED package disposed on the substrate and including at least one first LED chip, a second LED package disposed on the substrate and including at least one second LED chip, and a resistor disposed on the substrate, connected to the first LED package in series, and connected to the second LED package in parallel, in which the second LED package is connected in parallel to the first LED package and the resistor, and the first LED package and the second LED package are configured to emit light having different color temperatures.

A bulb-type light source includes a globe transmitting a light and at least one light emitting device filament disposed in the globe. The light emitting device filament includes a substrate including n (n is a natural number equal to or greater than 2) flat portions and n&#x2212;1 bendable portions disposed between the flat portions, a plurality of light emitting device chips disposed on the flat portions, a fluorescent substance layer covering each light emitting device chip and converting a wavelength of a light from each light emitting device chip, and a connection line disposed on the flat portions and electrically connecting the light emitting device chips adjacent to each other between the adjacent light emitting device chips.

A light emitting device filament includes a substrate having a first surface and a second surface opposite to the first surface and extending in one direction, at least one light emitting device chip disposed on the first surface, and an auxiliary pattern disposed on the second surface and disposed at a position corresponding to the light emitting device chip.

An apparatus for manufacturing a thermoelectric module is provided. The apparatus includes a thermoelectric element interposed between a lower substrate that includes a lower electrode and an upper substrate that includes an upper electrode. Additionally, the apparatus includes a first block that is configured to support the lower substrate and a second block that is configured to move vertically with respect to the first block and support the upper substrate. A jig is configured to position the thermoelectric element in connection with the upper electrode and the lower electrode.

Apparatus for manufacturing thermoelectric module

Disclosed herein is an aluminum alloy for a cylinder head. The aluminum alloy according to an embodiment comprises, by weight, Si: 4.5&#x2dc;5.0%, Cu: 3.0&#x2dc;4.0%, Fe: 0.2&#x2dc;0.5%, Mn: 0.02% or less (exclusive of 0%), Mg: 0.1&#x2dc;0.3%, Zr: 0.1% or less (exclusive of 0%), Cr: 0.1&#x2dc;0.2%, and a balance of Al and inevitable impurities to form 100%, with a reinforcing phase of Al(Fe,Cr)Si ranging from 1.0 to 2.3%.

Growing community of inventors

Gyeonggi-do, South Korea

Jong Kook Lee