Samsung Electronics Co., Ltd.

Jong-kill Lim

Jin-Sung Lee

Dong-Woo Lee

Tae-gyu Kim

Tae-sang Park

Chang-hoon Jung

Bang-weon Lee

Sang-kwon Wee

Bang-Weon Lee

A semiconductor wafer baking apparatus includes a hot plate, a container of which an upper part is open, and a cover that covers the upper part of the container. The cover includes an upper plate, a lower plate and a side wall that form a gas circulating space therebetween. At least one gas inlet is formed in the side wall, a plurality of gas supply holes are formed in a central region of the lower plate, and a skirt on which is formed a gas exhaust unit is coupled to a lower edge of the cover.

Semiconductor wafer baking apparatus

A wafer bake apparatus includes an air flow control unit of pneumatic cylinder structure operating interlockingly with a wafer lift unit and induces the air flow between a wafer and a hot plate. Therefore, when a wafer is placed in a baking position the air between the wafer and the hot plate descends. As a result, the wafer is no longer under the influence of air resistance, and can be more accurately placed in the baking position. In addition, when the baked wafer is lifted to an unloading position, the air between the hot plate and the wafer ascends, which in turn supports the wafer and prevents the distortion of the wafer.

Wafer bake apparatus

Growing community of inventors

Hwaseong-si, South Korea

Jong-kill Lim