Samsung Electronics Co., Ltd.

Jong-keun Ahn

Hyun-jin Kim

Sun-Pil Youn

Sang-Wook Kang

Sam-Yong Bahng

Chang-il Son

Semiconductor packages including a substrate, a plurality of first semiconductor chips stacked on the substrate, a second semiconductor chip interposed between the substrate and a lowermost semiconductor chip among the first semiconductor chips, and a supporting member disposed between the substrate and the lowermost semiconductor chip among the first semiconductor chips to support the first semiconductor chips, may be provided. The supporting member may include a passive element such as a capacitor, a resistor, or an inductor. By including the supporting member, the semiconductor packages may achieve a smaller planar size and have an improved tolerance for subsequent interconnections.

Semiconductor package having support member

A removable memory card can include a plurality of connector contacts including a Universal Serial Bus (USB) controller module power contact and a separate controller module power contact configured to provide separate mutually exclusively applied voltage to the removable memory card.

Growing community of inventors

Yongin-si, South Korea

Jong-keun Ahn