Samsung Electro-mechanics Co., Ltd.

Jong In Ryu

Do Jae Yoo

Suk Youn Hong

Seung Hyun Hong

Jae Hyun Lim

Kyu Hwan Oh

Jang Hyun Kim

Jin Su Kim

Ki Joo Sim

Gi Su Chi

Ki Chan Kim

Seung Wook Park

Sung Ho Kim

Young Do Kweon

Sun Ho Kim

Yul Kyo Chung

Tae Sung Jeong

Hye Kyung Kim

Hyung Jin Jeon

Eun Jung Jo

Seon Hee Moon

Ki Ju Lee

Ki Sung Lee

Hee Jung Jung

Seung Wan Shin

An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.

Electronic device module and method of manufacturing the same

An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Electronic device module, method of manufacturing the same and electronic apparatus

An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate, and a sealing portion having the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate. The shielding wall includes at least one insulating layer and at least one conductive layer disposed on the insulating layer.

Electronic device module

An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor.

An electronic device module includes a board including external connecting electrodes and mounting electrodes; an electronic device mounted on the mounting electrodes; a molded portion sealing the electronic device; connection conductors having an end bonded to the external connecting electrodes and penetrating through the molded portion; and external terminals bonded to another end of the connection conductors.

Electronic device module and manufacturing method thereof

A semiconductor package and manufacturing method thereof includes a chip member installed on an upper surface, a lower surface, or both of a substrate. The semiconductor package and manufacturing method thereof also include a mold part stacked embedding the chip member, a connection member disposed at a center portion of the mold part, and a solder part formed on a portion of the connection member.

Semiconductor package with improved signal stability and method of manufacturing the same

A double-sided package module includes a substrate, a first sealing member, a second sealing member, and an extension portion. The substrate includes electronic components positioned on a first surface and a second surface of the substrate. The first sealing member and the second sealing member are positioned on the first surface and the second surface, respectively. The extension portion protrudes from a lateral surface of the substrate into a space between the first sealing member and the second sealing member.

Double-sided package module and substrate strip

In one general aspect, an electronic device module includes a first board, a first device mounted on a first surface of the first board, a second board disposed below the first board, and a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board.

The package includes: a substrate having at least one circuit layer; at least one electronic component mounted on at least one surface of the substrate; a molded part formed on the surface of the substrate to enclose the electronic component; at least one via formed in the molded part to be electrically connected to the circuit layer of the substrate; and a pattern connected to one end of a plated tail connected to the circuit layer connected to the via and exposed to the exterior of the substrate.

Package and method of manufacturing the same

There are provided an electronic component module capable of increasing a degree of integration by mounting electronic components on both surfaces of a substrate, and a manufacturing method thereof. The electronic component module according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electronic components mounted on both surfaces of the substrate; connection conductors each having one end bonded to one surface of the substrate using an conductive adhesive; and a molded portion having the connection conductor embedded therein and formed on one surface of the substrate, wherein the connection conductor may have at least one blocking member preventing a spread of the conductive adhesive.

Electronic component module and manufacturing method thereof

A method for manufacturing an interposer includes forming a via hole in an insulation plate including a resin or a ceramic; simultaneously forming resists for a first upper redistribution layer on the top surface of the insulation plate, and a resistor for a lower redistribution layer on the bottom surface of the insulation plate; plating copper to fill the via hole and simultaneously forming the first upper redistribution layer and the lower redistribution layer along a designed circuit pattern; and forming a first upper protection layer and a lower protection layer to expose a portion of the first upper redistribution layer and a portion of the lower redistribution layer.

Method for manufacturing interposer

An embedded printed circuit board (PCB) includes: a copper foil laminate; an internal electronic component inserted into the copper foil laminate; a first circuit pattern formed on a surface of the internal electronic component; and a second circuit pattern formed on the copper foil laminate.

Growing community of inventors

Suwon-si, South Korea

Jong In Ryu