Lg Electronics Inc.

Skhynix Inc.

Lg Philips Lcd Co., Inc.

Lg Innotek Co., Ltd.

Yonsei University

Korea University Research and Business Foundation

Korea Kumho Petrochemical Co., Ltd.

Fieldcure Co., Ltd.

Other

Hynix Semiconductor Inc.

Suzhou Lekin Semiconductor Co., Ltd.

Lg.phillips Lcd Co., Ltd.

Medicinal Bioconvergence Research Center

Cj Cheiljedang Corporation

Yujin Robot Co., Ltd.

Jong Hyun Kim

Joung Won Woo

Seung Hwan Kim

Ki Young Kim

Sunghoon Kim

Min Soo Kim

Ji-Hye Lee

Kyeong Jin Kim

Hye Won Kim

Ki Hyuk Yoon

Mi Sook Nam

Yoo Jin Choi

Soon Bum Kwon

Oleg Yaroshchuk

Yuriy A Reznikov

Hyung Ju Choi

Jin Hee Jung

Young Seok Choi

Ki Yong Lee

Young Sam Yoo

Se Woon Lee

Kwang-Soon Kim

Youn Joon Sung

Woo Sik Lim

Qwan Ho Chung

Seong Ju Park

Jae Won Seo

Jin Ho Bae

Kyung Chul Shin

Jae Sung Oh

Yevgen Barsukov

Hyun Chul Seo

Bok Gyu Min

Sang Hwan Kim

Chulho Lee

Hyung Eui Lee

Jin Kyung Choi

Ki Seok Cha

Sahn Nahm

Chan Yeong Park

Gu Yong Lee

Moon Un Hyun

Jin Ho Gwon

Chul Oh Yoon

Andrey Dyadyusha

Jung Ha Kim

Myong Geun Yoon

Hee Hun Sung

Woo Jung Kang

Jonggook Kim

Geon Oh

Hyeon Ji Baek

Jun Phil Hwang

Jung Min Han

Tae Su Yang

No Soo Lee

Dong You Kim

Hoe Jun Kim

Soo Youn Hwang

Dong Jun Lee

Woo Chul Kim

Ki Il Moon

Gyoonhee Han

Yoo Min Eom

Hyoung Min Im

Sang Hyo Kweon

Woong Hee Lee

Yoo Jin Chol

Oleq Yaroshchuk

Yeon Ji Park

Seong Kweon Ha

Mun Aun Hyun

Jae Won Shin

Ki Bon Cha

Ho Sang Yoo

Hwan Joo Park

Hee Yol Jin

Kye Soo Jun

Youn Gyo Lee

Electrode for electric field therapy

Electrode array for electric field therapy

A quality assurance apparatus for a cancer treatment system with an electric field, comprising: an electric field generator configured to transmit an electric field to an inside of an electromagnetic phantom through an electrode array attached to the electromagnetic phantom; a measurement unit configured to measure any one of a voltage, a current, and an electric field inside the electromagnetic phantom; a data collection unit configured to collect a value measured by the measurement unit and convert the measured value into a digital value; an analysis unit configured to calculate and monitor a distribution and intensity of the electric field inside the electromagnetic phantom through the value transmitted from the data collection unit; and a verification unit configured to verify the electric field monitored by the analysis unit.

Quality assurance apparatus and method for cancer treatment system with electric field

A semiconductor package may include: a base layer; first to Nth semiconductor chips (N is a natural number of 2 or more) sequentially offset stacked over the base layer so that a chip pad portion of one side edge region is exposed, wherein the chip pad portion includes a chip pad and includes a redistribution pad that partially contacts the chip pad and extends away from the chip pad; and a bonding wire connecting the chip pad of a kth semiconductor chip among the first to Nth semiconductor chips to the redistribution pad of a k−1th semiconductor chip or a k+1th semiconductor chip when k is a natural number greater than 1 and the bonding wire connecting the chip pad of the kth semiconductor chip to a pad of the base layer or the redistribution pad of the k+1th semiconductor chip when k is 1.

Semiconductor package including stacked semiconductor chips

Provided according to an embodiment is a thermoelectric element comprising: a first insulating part; multiple first electrodes disposed on the first insulating part; a second electrode disposed above the first electrodes; a first conductive semiconductor structure and a second conductive semiconductor structure disposed while being spaced each other between the first electrodes and the second electrode; and a second insulating part disposed on the second electrode, wherein the first insulating part comprises first protrusions protruding toward the first electrodes, and the second insulating part comprises a second protrusion protruding toward the second electrode.

Thermoelectric element

According to an embodiment, disclosed is a thermoelectric device comprising: a thermoelectric element comprising a first substrate, a plurality of first electrodes disposed on the first substrate, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes, a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, and a second substrate disposed on the plurality of second electrodes; and a heat sink comprising a plurality of fins disposed to be spaced apart on the second substrate, wherein the second substrate comprises a first region overlapping the second electrodes in a vertical direction and a second region not overlapping the second electrodes in the vertical direction, and wherein separation distances between adjacent fins of the plurality of fins are different from each other in the first region and the second region.

Thermoelectric device

The present disclosure provides a system for planning electric field cancer treatment based on absorbed energy including: an image classification unit to classify a patient's medical image into an organ and a tumor; a property information setting unit to set property information for each region classified by the image classification unit; a prescription information determination unit to set a prescription method; a dose calculation unit to initially set the number and location of electrodes used for electric field cancer treatment and the electric field intensity for each electrode; and a dose optimization unit to optimize the dose by changing at least one electrode.

System and method for planning electric field cancer treatment based on absorbed energy

An electric field cancer treatment apparatus using a rotating alternating current (AC) electric field according to an embodiment of the present disclosure includes a plurality of electrode pairs configured to transmit AC electric fields to a target area in a body, a plurality of AC electric field generators respectively connected to the plurality of electrode pairs and configured to generate AC electric fields to be applied to the plurality of electrode pairs, and a controller configured to control generation of AC electric fields by the plurality of AC electric field generators.

Electric field cancer treatment apparatus and method using rotating alternating current electric field

Provided is a thermoelectric module. The thermoelectric module includes a thermoelectric element including a first substrate, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and a second substrate disposed on the second electrode, a heat sink disposed on the second substrate, and an adhesive layer configured to bond the second substrate to the heat sink. The heat sink has a shape in which predetermined patterns are regularly repeated and connected. Each pattern includes a first surface disposed opposite to the second substrate, a in second surface which extends upward from one end of the first surface, a third surface which extends from the second surface to face the second substrate, and a fourth surface which extends upward from the other end opposite to the one end of the first surface and is connected to a third surface of an adjacent pattern. A distance between the third surface and the second substrate is greater than a distance between the first surface and the second substrate, and the adhesive layer is disposed between the second substrate and the first surface.

Thermoelectric module

A semiconductor package may include: a base layer; first to Nth semiconductor chips (N is a natural number of 2 or more) sequentially offset stacked over the base layer so that a chip pad portion of one side edge region is exposed, wherein the chip pad portion includes a chip pad and includes a redistribution pad that partially contacts the chip pad and extends away from the chip pad; and a bonding wire connecting the chip pad of a kth semiconductor chip among the first to Nth semiconductor chips to the redistribution pad of a k&#x2212;1th semiconductor chip or a k+1th semiconductor chip when k is a natural number greater than 1 and the bonding wire connecting the chip pad of the kth semiconductor chip to a pad of the base layer or the redistribution pad of the k&#x2212;1th semiconductor chip when k is 1.

The present invention relates to a novel compound as an mTOR inhibitor and a use thereof and, more specifically, to a novel compound represented by formula 1 that exhibits mTOR inhibitory activity and a pharmaceutical composition comprising same as an active ingredient for preventing or treating brain diseases associated with an mTOR pathway.

Compound as mTOR inhibitor and use thereof

A scheduling method for grant-free multiple access, and a user terminal for the same are disclosed. The method comprises: (a) a step of receiving, from the user terminal, information on traffic to be served, network information of the user terminal and state information of the user terminal; (b) a scheduling step of forming scheduling groups on the basis of the information received in step (a) and a step of allocating resources to each scheduling group; and (c) providing scheduling information to the user terminal, wherein traffic aggregations for traffic of the terminal are set on the basis of the information on traffic from the terminal, the scheduling groups are formed according to the traffic aggregations, and the scheduling information is provided to each traffic aggregation by which the user terminal is to be served.

Scheduling method for grant-free multiple access, and user terminal for same

An embodiment provides a semiconductor device including a light-emitting structure including a plurality of light-emitting portions disposed at a side and a plurality of second light-emitting portions disposed at another side, a plurality of first connection electrodes configured to electrically connect the plurality of first light-emitting portions, a plurality of second connection electrodes configured to electrically connect the plurality of second light-emitting portions, a first pad disposed on the plurality of first light-emitting portions, and a second pad disposed on the plurality of second light-emitting portions. The first pad includes a plurality of 1-2 pads extending toward the second pad. The second pad includes a plurality of 2-2 pads extending toward the first pad. The first connection electrode includes a region between the plurality of 1-2 pads in a thickness direction of the light-emitting structure. The second connection electrode includes a region between the plurality of 2-2 pads in the thickness direction of the light-emitting structure.

Semiconductor device having a first pad not overlapping first connection electrodes and a second pad not overlapping second connection electrodes in a thickness direction

A semiconductor package includes: a package substrate; a first semiconductor chip disposed over the package substrate and having a center region and an edge region; and a package redistribution layer disposed over the first semiconductor chip, wherein the first semiconductor chip comprises: a lower structure; a redistribution conductive layer disposed over the lower structure and electrically connected to the lower structure, the redistribution conductive layer including a redistribution pad disposed in the center region; and a protective layer covering the lower structure and the redistribution conductive layer, and having an opening exposing the redistribution pad, wherein the package redistribution layer comprises: a package redistribution conductive layer connected to the redistribution pad and extending to the edge region, the package redistribution conductive layer including a package redistribution pad disposed in the edge region, and, wherein, in the edge region, the redistribution conductive layer is omitted.

Semiconductor package including a semiconductor chip having a redistribution layer

A thermoelectric device is disclosed. The thermoelectric device comprises: a body part comprising a hollow in which a semiconductor device is disposed; a plurality of connecting parts protruding on the lateral sides of the body part and comprising connecting holes; and a plurality of electrode parts connected to the semiconductor device and extending to the connecting holes of the connecting parts.

Thermoelectric device and thermoelectric module

Growing community of inventors

Seoul, South Korea

Jong Hyun Kim