Samsung Electronics Co., Ltd.

Jong-Hyoung Lim

Sang-Seok Kang

Sang-Man Byun

Hyung-Shin Kwon

Chung-Ki Lee

Chang-Soo Lee

Hong-Sun Hwang

Jin-Seok Lee

Ji-hyun Lee

Jae-Hoon Joo

Ji-Hyun Lee

Ji-Hun Lee

Dae-Sun Kim

Jang-won Moon

Gwan-pyo Hong

Dae-sun Kim

Chang-Joo Choi

Jung-Il Mok

Byung-Il Ryu

Sang-cheol Kim

Sang-ki Son

A method of testing a semiconductor memory device is provided. Data is written to a plurality of memory cells disposed in a memory cell block of the semiconductor memory device. A first driving voltage is applied to a first group of word lines. A second driving voltage is applied to a second group of word lines. Each word line of the first group of the word lines is interposed between two neighboring word lines of the second group of the word lines. The first driving voltage has a voltage level different from that of the second driving voltage. The data is read from first memory cells coupled to the first group to determine whether each of the first memory cells is defective.

Semiconductor memory device, method of testing the same and method of operating the same

A semiconductor device may include a first memory cell connected to a bit-line and a first word-line, a second memory cell connected to a complementary bit-line and a second word-line, and an equalizer. The equalizer may be configured to transition a voltage of the bit-line and the complementary bit-line from a first voltage to a second voltage different from the first voltage at a first time period when the bit-line and complementary bit line are floating, and to transition the voltage of at least one of the bit-line and the complementary bit-line from the second voltage to a third voltage at a second time period after the first time period when the bit-line and complementary bit line are floating, the third voltage being different from the first and second voltages.

Memory core and semiconductor memory device including the same

A multiple well bias memory device that includes a semiconductor substrate; a first well of a first conductivity type formed in the semiconductor substrate and having a memory cell formed therein; and a second well of the first conductivity type formed in the semiconductor substrate and having formed therein a sense amplifier configured to sense and amplify data from the memory cell. The first and second wells have different doping concentrations and are biased to first and second voltages, respectively. The first voltage being lower than the second voltage.

Multiple well bias memory

A semiconductor memory device and method directed to performing a memory operation in a semiconductor memory device are provided. The method includes receiving a write command signal from a memory controller; receiving data from the memory controller, the data including n pieces of data, wherein the k-th piece of data comprises masking data to be masked; and receiving a data masking signal from the memory controller, the data masking signal including enable information that enables data masking, and non-enable information for not enabling data masking, wherein the enable information is used to mask the k-th piece of data. A latency between receiving the write command signal and receiving the enable information is less than a latency between receiving the write command and receiving the k-th piece of data.

Semiconductor memory device and method of performing a memory operation

A bit line sense amplifier circuit for use in a semiconductor memory device, and a control method thereof, in which the bit line sense amplifier circuit is controlled to maintain a precharge state thereof until a sense amplifier enable signal to enable the sense amplifier circuit is applied, thereby preventing the bit line sense amplifier circuit of the semiconductor memory device from floating, and preventing or substantially reducing a coupling effect, thereby providing a precise data sensing and amplification operation.

Bit line sense amplifier of semiconductor memory device and control method thereof

A semiconductor memory device and related test method are disclosed. Test data is defined from a group of M test bits selected from either input data or corresponding output data. A parallel bit test is then conducted on the test data. The M test bits include N test bits, where N is less than M, selected on a bit by bit basis from the output data, and L test bits, where N+L=M, selected from the input data. The selection of input data may be made in accordance with a don't care case for selected test data.

Semiconductor memory device capable of arbitrarily setting the number of memory cells to be tested and related test method

A semiconductor memory device is provided. The device includes an on die termination circuit controlling a termination resistance value by detecting a phase change of a signal inputted through a pad. Additionally, the on die termination circuit changes the termination resistance value when an identical phase signal is inputted during n (n is positive integer) periods of a clock signal.

Semiconductor memory device including on die termination circuit and on die termination method thereof

A row active time control circuit is described that includes a master signal generating circuit and a row active control signal generating circuit. The master signal generating circuit generates one or more row active master signals based on an active command signal, a pre-charge command signal, and one or more row active control signals. The row active control signal generating circuit generates a pulse signal that oscillates based on the one or more row active master signals. The row active control signal also generates the one or more row active control signals by dividing a frequency of the generated pulse signal.

Row active time control circuit and a semiconductor memory device having the same

A semiconductor memory device and method directed to performing a memory operation in a semiconductor memory device, which include receiving data and a data masking signal corresponding to a portion of the received data configured to be written into memory in response to a write command and the data masking signal configured to block the at least a portion of the received data from being written into the memory, and further configuring different timing parameters of the received data and the data masking signal for executing the write command without writing the at least a portion of the received data into the memory.

There are provided a semiconductor memory device and a burn-in test method thereof. A semiconductor memory device according to an aspect of the invention includes a plurality of memory cell blocks, each of which includes a plurality of memory cells that are respectively coupled to a plurality of word lines and a plurality of bit lines, a word line control unit activating word lines in memory cell blocks that correspond to row address signals and word lines in memory cell blocks that do not correspond to the row address signals, during a test operation, and a write circuit writing data in the memory cell blocks that correspond to the row address signals and not writing data in the memory cell blocks that do not correspond to the row address signals, during the test operation.

Semiconductor memory device and burn-in test method thereof

An input/output sense amplifier (IOSA) controller of a semiconductor memory device includes an auto pulse generator and a latch enable signal generating circuit. The auto pulse generator generates an auto pulse signal having a first pulse shape. The latch enable signal generating circuit generates a first latch enable signal having a second pulse shape in response to an auto pulse signal in normal mode, and generates a second latch enable signal having a level shape that is enabled for long duration in response to the write enable bar signal in test mode. Accordingly, the semiconductor memory device including the IOSA controller may safely test a characteristic of the IOSA.

Circuit and method of controlling input/output sense amplifier of a semiconductor memory device

A bit line sense amplifier and method thereof are provided. The example bit line sense amplifier may include a sense amplifying circuit coupled between a first bit line and a second bit line. The sense amplifying circuit may be configured to amplify a voltage difference between the first bit line and the second bit line. The example bit line sense amplifier may further include a power supply voltage providing circuit configured to provide a first power supply voltage and a second power supply voltage to the sense amplifying circuit in response to first and second bit line sensing control signals. The bit line sense amplifier may further include a bit line voltage compensation circuit configured to prevent a voltage-reduction at the first bit line and the second bit line for a delay period, the delay period including at least a period of time after a pre-charging of the first and second bit lines, in response to one or more of the first and second bit line sensing control signals.

Bit line sense amplifier and method thereof

Provided is a semiconductor memory device. The semiconductor memory device includes: a memory cell array including regular cells; a redundancy memory cell array including redundancy cells for substituting for defective regular cells; a command decoder for generating an operation mode selection signal in response to command signals; a redundancy cell test controller for generating a test operation control signal and transmitting address signals in response to the operation mode selection signal; and a redundancy decoder for decoding the address signals to select the redundancy cells in response to the test operation control signal. All redundancy cells can be selected and tested based on the external command signal and the address signal, and thus it is possible to check all redundancy cells for defects in advance even after the semiconductor memory device is packaged, and to enable only non-defective redundancy cells to be substituted for defective regular cells. This increases the reliability of a repair operation.

Semiconductor memory device for testing redundancy cells

An internal supply voltage generation circuit includes first and second driving circuits and a resistive device. The first driving circuit receives a feedback voltage from a first node and generates a first output voltage based on first and second reference voltages to provide the first output voltage to the first node. The first output voltage is maintained between the first and second reference voltages. The second driving circuit receives a feedback voltage from a second node voltage and generates a second output voltage based on third and fourth reference voltages to provide the second output voltage to the second node. The second output voltage is maintained between the third and fourth reference voltages, and the second output voltage of the second node is provided as an internal supply voltage. The resistive device is coupled between the first and second nodes.

Circuit and method of generating internal supply voltage in semiconductor memory device

A circuit and method for test mode entry of a semiconductor memory device are provided. In a method of entering a semiconductor memory device into a test mode, an internal clock is generated in response to an external clock when a first condition is satisfied. An address combination signal is generated based on a first address combination and the internal clock. The semiconductor memory device is entered into the test mode using the internal clock and the address combination signal.

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Hwaseong-si, South Korea

Jong-Hyoung Lim