Samsung Electro-mechanics Co., Ltd.

Jong Hyeong Song

Yun Sung Kang

Hae Seung Hyun

Kwang Su Kim

Jeong Il Lee

Pil Joong Kang

Seung Joo Shin

Jong Woo Han

Ji Hye Nam

Jeong Suong Yang

Seung Do An

Kang Joo Kim

Nam Jung Lee

Sang Kyeong Yun

Won Jae Han

Yeong Gyu Lee

Heung Woo Park

Haeng Seok Yang

Hyun Kee Lee

Chang Su Park

Kyungno Lee

Kyung No Lee

Soon Seock Kang

The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.

Electronic element package and method for manufacturing the same

An acoustic wave filter device includes a base having an acoustic wave filter part and a bonding part disposed thereon, the bonding part surrounding the acoustic wave filter part, and a cap having a bonding counterpart disposed thereon, the bonding counterpart being bonded to the bonding part of the base, and the bonding part includes a first bonding layer including gold, and the bonding counterpart includes a second bonding layer bonded to the first bonding layer and including tin.

Acoustic wave filter device and package and method of manufacturing the same

The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.

Disclosed herein is a TPMS transmission module having a power saving function, the TPMS transmission module including: a micom outputting a switch turn-off control signal when a vehicle having the TPMS transmission module mounted therein is stopped; a switch supplying a power when the switch is turned on and blocking the supply of the power when it is turned off; an energy generator generating and outputting an electric power when a tire rotates; and a switch controller turning on the switch when the electric power of a predetermined voltage or more is generated in the energy generator and turning off the switch when a switch turn off control signal is output from the micom.

TPMS transmission module having power saving function

Disclosed herein is a tire pressure monitoring system, including an electrical device unit including a pressure sensor for detecting an air pressure of a tire; a housing that is accommodated in the electrical device unit and into which the air pressure of the tire is introduced; a valve antenna having one end that is inserted into the housing and the other end into which the air pressure of the tire is introduced; a conduction member having one end that is electrically connected to the electrical device unit and the other end that is electrically connected to the valve antenna; and a coupling member fixing and coupling the housing and the valve antenna to each other, wherein the valve antenna transmits a pressure signal about the air pressure of the tire, which is detected by the pressure sensor, to a receiver of a vehicle.

Tire pressure monitoring system

There is provided a haptic feedback actuator according to an exemplary embodiment of the present invention, including: a vibrating plate provided on one surface of a haptic device to transfer vibrations; and an actuator provided on the haptic device and including a composite layer in which a sensing electrode providing a sensing voltage Va based on a touch pressure of the haptic device and a driving electrode providing a driving voltage Vd corresponding to the sensing voltage Va are formed and a piezoelectric material generating vibrations according to the driving voltage Vd by being combined with one surface of the composite layer.

Haptic feedback actuator, haptic feedback device and electronic device

Disclosed herein is a device for detecting a tire position. The device for detecting a tire position includes a plurality of transmitters provided on each of a plurality of vehicle wheels having a tire and detecting and transmitting a rotation direction and a rotation period of each vehicle wheel; and a receiver mounted on a vehicle body and identifying the left and right of the corresponding vehicle wheel according to the rotation direction of each vehicle wheel and identifying the front and rear of the corresponding vehicle wheel according to the rotation period of each vehicle wheel. By the above configuration, the present invention can identify the tire position without performing the ID information and the ID information update and thus, improve a freedom of change of the tire position and can digitize and process signals from a acceleration sensor to be strong against noise and reduce load.

Device and method for detecting tire position

A display device using a light modulator and having an improved numerical aperture (NA) of an after-edge lens system is disclosed. The display device includes an illumination lens, a diffractive light modulator, an NA improvement unit, a filter system and a projection system. The illumination lens converts light into linear parallel light, and outputs the linear parallel light. The diffractive light modulator produces diffracted light beams having a plurality of diffraction orders by modulating the linear parallel light incident from the illumination lens according to an external control signal. The NA improvement unit causes + and &#x2212; diffracted light beams of the diffracted light beams to come close to each other. The filter system passes only some of the diffracted light beams having predetermined orders, therethrough. The projection system focuses the diffracted light beams onto an object and allows the focused diffracted light to scan the object.

Display device using light modulator and having improved numerical aperture of after-edge lens system

A semiconductor package using flip-chip mounting technique is disclosed. The semiconductor package includes: a semiconductor device provided with a plurality of first pads extending from the semiconductor device; a substrate provided with a plurality of second pads extending from the substrate at positions in registry with the location of the first pads of the semiconductor device; and an anisotropic conductive material interposed between the plurality of first pads and the plurality of second pads to electrically connect the first pads to associated second pads, the anisotropic conductive material positioned at discrete locations around the semiconductor device, thereby providing unobstructed clearance at desired locations between the semiconductor device and the substrate.

Growing community of inventors

Gyunggi-do, South Korea

Jong Hyeong Song