Qimonda Ag

Qimonda North America Corporation

Infineon Technologies Ag

Infineon Technologies North America Corp.

Jong Hoon Oh

Wayne Frederick Ellis

Oliver Kiehl

Klaus Hummler

Josef Schnell

Lee Ward Collins

Octavian Beldiman

Jung Pill Kim

Ralf Klein

Alan Deng

Jung Pil Kim

An integrated circuit includes a data bus and a first memory device coupled to the data bus. The first memory device is configured to provide a first signal in response to completing a power-up sequence of the first memory device. The integrated circuit includes a second memory device coupled to the data bus. The second memory device is configured to provide a second signal in response to completing a power-up sequence of the second memory device. The integrated circuit includes a controller configured to access the first memory device and the second memory device based on the first signal and the second signal.

Integrated circuit including multiple memory devices

A multi-chip package is provided that has at least a first, second and third chip, each comprising a top and bottom surface. The multi-chip package also has a package substrate for interfacing with a printed circuit board (PCB). The chips and the package substrate are housed within an encapsulation material. The bottom surface of the first chip is attached to the package substrate. The top surface of the first chip has a first plurality of landing pads, which serve as a mechanical and electrical interface between the first and second chip. The bottom surface of the second chip has a second plurality of landing pads that serve as a mechanical and electrical interface between the second and first chip. Additionally, the top surface of the second chip has a third plurality of landing pads that serve as a mechanical and electrical interface between the second and third chip.

Multi-chip package with interconnected stacked chips

A refresh scheduler is configured to refresh memory cells of a memory device according to a plurality of refresh intervals. The various refresh intervals are determined in response to refresh errors.

Memory refresh system and method

Embodiments of the present invention generally provide techniques and apparatus for altering the functionality of a multi-chip package (MCP) without requiring entire replacement of the MCP. The MCP may be designed with a top package substrate designed to interface with an add-on package that, when sensed by the MCP, alters the functionality of the MCP.

Method and structure of expanding, upgrading, or fixing multi-chip package

Embodiments of the invention generally provide a system, method and memory device for accessing memory. One embodiment includes synchronization circuitry configured to determine timing skew between a first memory device and a second memory device, and introduce a delta delay to at least one of the first memory device and the second memory device to adjust the timing skew.

Method and apparatus for synchronizing memory enabled systems with master-slave architecture

Embodiments of the invention generally provide a system, method, and memory device for accessing memory. In one embodiment, a first memory device includes command decoding logic configured to decode commands issued to the first memory device and a second memory device, while command decoding logic of the second memory device is bypassed.

Method and apparatus for implementing memory enabled systems using master-slave architecture

The present invention is generally related to integrated circuit devices, and more particularly, to methods and systems of a multi-chip package (MCP) containing a self-diagnostic scheme for detecting errors in the MCP. The MCP generally comprises a controller, at least one volatile memory chip having error detection logic, at least one non-volatile memory chip, and at least one fail signature register for storing fail signature data related to memory errors detected in the MCP. The controller can poll the fail signature register for fail signature data related to memory errors stored therein. Upon detection of fail signature data, the controller can store the fail signature data on a fail signature register located on a non-volatile memory.

Self-diagnostic scheme for detecting errors

Embodiments of the invention generally provide an apparatus and technique for sharing an internally generated voltage between devices of a multi-chip package (MCP). The internally generated voltage may be shared via a conductive structure that electrically couples the devices and carries the internally generated voltage.

Structure to share internally generated voltages between chips in MCP

A synchronous DRAM (SDRAM) terminates a write operation in response to detecting deactivation of a data strobe signal applied to it during the write operation. In one example, the SDRAM comprises a buffer circuit and an early write termination circuit. The buffer circuit is configured to sample input data responsive to a data strobe signal applied to the SDRAM during a write operation and direct the input data to one or more memory cells of the SDRAM for storing the input data. The early write termination circuit is configured to terminate the write operation at less than a programmed burst length by disabling access to one or more of the memory cells after storage of the sampled input data responsive to detecting deactivation of the data strobe signal.

Growing community of inventors

Chapel Hill, NC, United States of America

Jong Hoon Oh