Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Jong Hoon Lim

Grigory Onushkin

Joong Kon Son

Tae Hun Kim

Pun Jae Choi

Seung Woo Choi

Myong Soo Cho

Yung Ho Ryu

Sang Su Hong

Sung Joon Kim

Gyeong Seon Park

Oleg Ledyaev

A method of forming a metal bonding layer includes forming first and second bonding metal layers on one surfaces of first and second bonding objects, respectively. The second bonding object is disposed on the first bonding object such that the first bonding metal layer and the second bonding metal layer face each other. A eutectic metal bonding layer is formed through a reaction between the first and second bonding metal layers. At least one of the first bonding metal layer and the second bonding metal layer includes an oxidation prevention layer formed on an upper surface thereof. The oxidation prevention layer is formed of a metal having an oxidation reactivity lower than an oxidation reactivity of the bonding metal layer on the upper surface which the oxidation prevention layer is disposed.

Method of forming metal bonding layer and method of manufacturing semiconductor light emitting device using the same

A semiconductor light emitting device has a semiconductor laminate including first and second conductivity type semiconductor layers respectively providing first and second main surfaces and an active layer. The semiconductor laminate is divided into first and second regions. At least one contact hole is formed to pass through the active layer from the second main surface of the first region. A first electrode is formed on the second main surface to be connected to the first conductivity type semiconductor layer of the first region and the second conductivity type semiconductor layer of the second region. A second electrode is formed on the second main surface of the first region to be connected to the second conductivity type semiconductor layer of the first region and the first conductivity type semiconductor layer of the second region.

Semiconductor light emitting device with contact hole passing through active layer

Disclosed are a light emitting diode (LED) inspection apparatus, which can determine whether an LED has a defect such as leakage current, without making physical contact with the LED being inspected, and an LED inspection method thereof. The LED inspection apparatus includes an ultraviolet emission unit emitting UV light to an LED, an image generation unit generating an image of the LED to which the UV light is emitted, and a control unit obtaining color or intensity information of the LED from the image of the LED and determining, based on the color information, whether the LED is defective.

LED inspection apparatus and LED inspection method using the same

Growing community of inventors

Gyunggi-do, South Korea

Jong Hoon Lim