Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Rensselaer Polytechnic Institute

Jong-hoon Kim

Kwang-Soo Park

Jae-jun Lee

Kyoung-oh Choi

Young-ran Han

Young-chan Jang

Hoe-Ju Chung

Sang-Seok Kang

Hyun-mook Choi

Jeong-Seok Park

Jeong-hyun Park

Jin-ho So

Myung-Hee Sung

Kwang-Su Seo

Kwang-Ho Jung

Moon-Jung Kim

Jung-gun Byun

Joung-ho Kim

Sang-beom Ahn

Hyun-ae Lee

Seung-myen Lee

Yang-gyu Kim

Sinn-bong Yoon

Yong-sun Song

Pil-jung Jun

Han-sol Choi

Dong-gun Kam

A defrosting apparatus includes: an evaporator; a defrosting heater removing frost formed on the evaporator; and a controller controlling the defrosting heater until defrosting for the evaporator is completed when a driving start command for the defrosting apparatus is input, wherein the controller controls the defrosting heater to have an idle section in which the defrosting heater is not operated between a point in time in which the driving start command is input and a point in time in which the defrosting is completed.

Defrosting apparatus, refrigerator including the same, and control method thereof

A display apparatus having a screen on which recording by a user's touch can be performed is provided. The display apparatus includes a display configured to provide the screen, an accommodator configured to accommodate the display and having a screen aperture formed thereon with a predetermined depth to expose the screen, a touch position sensor configured to sense the position of a touch device that is used by a user when a distance between the screen and the touch device is shorter than the predetermined depth, a vibration sensor mounted on the display and configured to sense vibration of the display due to a contact of the touch device with the screen, and a controller configured to control the display to perform recording on a point of the screen that corresponds to the sensed position of the touch device when the vibration is sensed.

Display apparatus

An electronic device is provided, which includes a touch sensor configured to sense a touch input to a screen, a storage configured to store different firmware corresponding to a plurality of input modes supported by the touch sensor, and a controller configured to sense the touch input according to a selected input mode among the plurality of input modes, through execution of one of the different firmware corresponding to the selected input mode.

Electronic device and touch sensing method thereof

A semiconductor memory device, a semiconductor memory module, and a semiconductor memory system including the same, the semiconductor memory device including a command/address input buffer that receives a command/address signal and a command/address reference voltage signal, wherein the command/address input buffer is configured to amplify a difference between the command/address signal and the command/address reference voltage signal, and is further configured to output the amplified difference between the command/address signal and the command/address reference voltage signal, and a chip selection input buffer that receives a chip selection signal and a chip selection reference voltage signal, wherein the chip selection input buffer is configured to amplify a difference between the chip selection signal and the chip selection reference voltage signal, and is further configured to output the amplified difference between the chip selection signal and the chip selection reference voltage signal, wherein a voltage level of the command/address reference voltage signal is different from a voltage level of the chip selection reference voltage signal.

Semiconductor memory device, semiconductor memory module and semiconductor memory system including the semiconductor memory device

A semiconductor device is provided. The semiconductor device includes a chip having a plurality of first power voltage terminals connected in common to a first power voltage line, a plurality of second power voltage terminals connected in common with a second power voltage line, a first connection terminal, a second connection terminal connected to the first power voltage line or the second power voltage line, and an on-die capacitor. The semiconductor device also includes a package having a plurality of third power voltage terminals connected to the first power voltage terminals through a first wire by wire bonding during a packaging process and a plurality of fourth power voltage terminals connected to the second power voltage terminals through a second wire by wire bonding during the packaging process, and configured to package the chip, wherein one end of the on-die capacitor is connected to the first connection terminal, and the first connection terminal is connected to the second connection terminal through a third wire by wire bonding during the packaging process.

Semiconductor device

A printed circuit board (PCB) includes a substrate having a first group of at least two via holes and a second group of at least two via holes formed therein, a first pad set of terminal pads and a second pad set of terminal pads formed on the substrate, and a first group of conductive connection members and a second group of conductive connection members formed in the substrate. The first group of the via holes are surrounded by the first pad set of the terminal pads and the second group of the via holes are surrounded by the second pad set of the terminal pads. The first and the second groups of conductive connection members fill up the first and second groups of the via holes. The first group of the conductive connection members are connected to the first pad set of the terminal pads and the second group of the conductive connection members are connected to the second pad set of the terminal pads.

Printed circuit board and semiconductor module having the same

A termination circuit is connected to an input buffer receiving a data signal, and includes at least one termination resistor connected to the input buffer for impedance matching. At least one switch controls a connection between the input buffer and a corresponding one of the at least one termination resistors. A control signal generator generates a control signal for selectively enabling the termination circuit by controlling each of the at least one switches. The control signal has an input period less than or equal to an input period of a data signal.

Termination circuits and semiconductor memory devices having the same

Data transmission system and method are provided. The transmission system includes a data converter and data restoring unit. The data converter converts N-bit first data to be transmitted into M-bit second data, where M is greater than N and the second data is arranged in a minimum unit greater than 1, each minimum unit including at least successive data bits having the same phase. The transmitter compresses the second data prior to transmission via a channel having performance characteristics defining a minimum pulse width, and a receiver receives and de-compresses the transmitted second data. The data restoring unit then restores the first data from the second.

Data transmission system and method

A sliding module for a portable terminal which has a first housing and a second housing sliding on the first housing is disclosed, the sliding module slidably coupling the first and second housings. The sliding module includes a sliding plate mounted on a surface of the first housing; at least one guide rod mounted on a surface of the second housing and slidably coupled to the sliding plate, the guide rod being extended in the longitudinal direction of the second housing; at least one first guide rib formed on the sliding plate; and at least one second guide rib formed on the surface of the second housing, wherein the second guide rib is slidably engaged with the first guide rib, and maintains at least partial engagement with the first guide rib within a sliding range of the second housing.

Sliding module for portable terminal

A probe card to connect a semiconductor device to test equipment includes a Printed Circuit Board (PCB) in which an electrical wiring pattern is formed, a first connector fixed on an upper surface of the PCB to connect the test equipment to the PCB, probe needles connected to electrode pads of the semiconductor device, and a Flexible PCB (FPCB) to connect the PCB to the probe needles. Accordingly, a signal transmission characteristic can be enhanced, test expenses can be reduced, and ground noise can be reduced.

Probe card including a sub-plate with a main supporter and a sub-supporter with the sub-supporter having probe needles

A semiconductor device, a method related to the semiconductor device, and a printed circuit board are disclosed. The semiconductor device includes a chip, a package including a plurality of power voltage terminals and a plurality of ground voltage terminals, wherein the chip is disposed in the package. The semiconductor device further includes an impedance circuit connected between a DC component power voltage terminal and a ground voltage, wherein the DC component power voltage terminal is one of the plurality of power voltage terminals, and an AC component interrupter connected between the DC component power voltage terminal and a power voltage. Both the AC component and a DC component of the power voltage are applied to each of the power voltage terminals except the DC component second power voltage terminal, and the ground voltage is applied to each of the ground voltage terminals.

Semiconductor device, related method, and printed circuit board

A transmission system and method may be provided. The transmission system may transmit 2-bit data for each transmission line set and each transmission line set may include first, second and/or third transmission lines arranged in order. The first, second and/or third transmission lines may respectively transmit first, second and/or third signals each having one of first, second and/or third values such that a combination of a first electric field between the first and second transmission lines and a second electric field between the second and third transmission lines may be made depending on a logic state of the 2-bit data. The transmission system may transmit differential signals using a smaller number of transmission lines and the transmission system may transmit a larger number of signals in the same circuit area.

Transmission system and method

A signal transmission circuit and method thereof are provided. The signal transmission circuit may include a plurality of signal transmission lines, each of the plurality of signal transmission lines configured to transfer data via signal currents and a reference transmission plane configured to transfer return currents corresponding to the signal currents, the reference transmission plane separated from each of the plurality of signal transmission lines by an insulating layer, the reference transmission plane including at least one separation slot.

Plural signal transmission line circuits having a reference plane with separation slots therein corresponding to the plural signal transmission lines

A memory system is disclosed with first, second, and third connectors located on a system board, the third connector including pins connected to the pins of the first and second connectors through channels, and a memory controller connected to the pins of the third connector through channels. The memory system, as configured in a first memory capacity, comprises; dummy memory modules and a first memory module connected to the memory controller by installing the dummy memory modules in the first and second connectors and installing the first memory module in the third connector. The memory system, as alternately configured in a second memory capacity larger than the first memory capacity, comprises second memory modules connected to the memory controller by installing the second memory modules in only the first and second connectors.

Memory system capable of changing configuration of memory modules

A spread spectrum clock generator includes a plurality of delay cells, wherein each delay cell includes at least one delayer receiving an external clock signal and causing a predetermined propagation delay to the received clock signal, and a controller transmitting a control signal to the delayer to control the propagation delay of the delayer according to a state value of the control signal. With this configuration, the spread spectrum clock generator using a delayer can have a simple circuit configuration and effectively attenuate an EMI.

Growing community of inventors

Hwaseong-si, South Korea

Jong-hoon Kim