Samsung Electronics Co., Ltd.

Jong Ho Yun

Joo Hyung Lee

Byung Lyul Park

Ki Tae Park

Joon Seok Oh

A semiconductor package includes an insulating layer including a first face and a second face opposite each other, a redistribution pattern including a wiring region and a via region in the insulating layer, the wiring region being on the via region, and a first semiconductor chip connected to the redistribution pattern. The first semiconductor chip may be on the redistribution pattern. An upper face of the wiring region may be coplanar with the first face of the insulating layer.

Growing community of inventors

Daegu, South Korea

Jong Ho Yun