Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Hyundai Motor Company

Kia Motors Corporation

Korea Advanced Institute of Science and Technology

Sungkyunkwan University

Skc Co., Ltd.

Kia Corporation

Db Hitek Co., Ltd.

Security Platform Inc.

Information and Communication Univerity Research and Industrial Cooperation Group

Jong Ho Lee

Myung Jun Park

Hyun Hee Gu

Ki Pyo Hong

Yong Jong Park

Ji Hong Jo

Woo Chul Shin

Doo Il Kim

Kyoung Jin Cha

Ho Sam Choi

Jae Yeol Choi

Min Woo Kim

Jin Hwan Kim

Jin Woo Kim

Seung Wook Park

Jong Hoon Kim

In Yong Jung

Hwi Dae Kim

Jin Woo Lee

Min Byeong Lee

Chang Sik Kim

Jin Su Park

Sung Woo Kim

Dong Hwan Lee

Un-Byoung Kang

Dong Hoon Kim

Jin Ho Park

Dong Ho Lee

Jin Seong Heo

Sang Soo Park

Jin-Woo Park

Min Cheol Park

Young Ghyu Ahn

Seung Hwan Kim

Sung Tae Kim

Hyung Joon Kim

Kyung Soo Kim

Jae Koog An

Hyun Sook Kim

Tae Young Kim

Jang Yeol Lee

Yoo Jeong Lee

Sim Chung Kang

Hye Young Choi

Eun Jung Lee

Jea Won Lee

Chung Yeol Lee

Jae Hyun Lee

Moon Soo Park

Chung Eun Lee

Jung Soo Lim

Jin Hyun Lee

Yoon Soo Kim

Chang Soo Park

Chin Mo Kim

Hak Kwan Kim

Hang Kyu Cho

Chang Hwa Park

Dae Hee Lee

Hyung Soon Kwon

Jung Min Park

Eun Jin Kim

Jung Min Choi

Joo Woong Yang

Kyung Hun Lee

Woo Yong Sung

Jung Min Kim

Doo Young Kim

Jae Ho Choi

Sung Jun Kim

Jong Hyun Kim

Sang Il Kim

Jae Sung Park

Chul Woo Lee

Hye Yeon Cha

Ki Yong Lee

Young Mi Kim

Sang Huk Kim

Jong Ho Park

Jin Kyu Kim

Kyung Rok Kim

Jang Mi Lee

Ki Hwan Kwon

Jinsoo Park

Sun Hee Park

Yong Soo Kyong

Byoung Yull Yang

Eun Hyuk Chae

Jung Seok Hahn

Eun-Chul Ahn

Seung In Baik

Chul Seung Lee

Ki Nam Kim

Hwang Mook Cho

Ji Hye Han

Jin Hyuck Heo

Beom Seock Oh

Han Seo Cho

A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction; external electrodes disposed on the body; and side margin portions disposed on the body, wherein an average content of Sn included in the side margin portion is 0.1 mol % or more and 4.0 mol % or less, wherein a Ba/Ti ratio of the side margin portion is greater than 1.040 and less than 1.070, and wherein an average size of a plurality of dielectric grains included in the side margin portion satisfies 100 nm or more and 290 nm or less.

Multilayer electronic component

A multilayer electronic component includes a body including a dielectric layer and internal electrodes disposed in a first direction with the dielectric layer interposed therebetween, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces. Each of the side margin portions includes a first region adjacent to the internal electrodes, and a second region adjacent to an outside of each of the side margin portions. An average Sn amount of the first region is lower than an average Sn amount of the second region. An Sn amount of the first region gradually increases from a side of the internal electrodes to the second region.

A multilayer electronic component includes a body including a capacitance formation portion in which a plurality of dielectric layers and a plurality of internal electrodes are alternately disposed in a first direction, a first cover portion disposed on one surface of the capacitance formation portion in the first direction and including a dielectric layer, and a second cover portion disposed on the other surface of the capacitance formation portion in the first direction and including a dielectric layer; and an external electrode disposed on the body, wherein a molar ratio of Sn/(Ni+Sn) measured in a central portion of an internal electrode disposed closest to the first cover portion or the second cover portion is 0.00160 or more and 0.0230 or less, and a molar ratio of Sn/(Ni+Sn) measured in a central portion of at least one internal electrode, among the plurality of internal electrodes, is 0.00066 or less.

An actuator for optical image stabilization includes a fixed frame having an internal space, a movable frame accommodated in the fixed frame and movable relative to the fixed frame, a first driving unit including a plurality of coils disposed on one of the fixed frame and the movable frame and a plurality of magnets disposed on the other, and a sensor substrate including a moving portion coupled to the movable frame, wherein a wiring pattern is disposed inside one of the fixed frame and the movable frame, and the plurality of coils and the sensor substrate are electrically connected by the wiring pattern.

Actuator for optical image stabilization and camera module including the same

A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and an internal electrode alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion opposing each other in the first direction, and an external electrode disposed on the outside of the body and connected to the internal electrode. The cover portion has a first region, adjacent to the capacitance formation portion, and a second region, adjacent to the outside of the cover portion. A content of fluorine (F) included in the second region is greater than a content of fluorine (F) included in the first region.

A ceramic electronic component, includes: a body including a dielectric layer and first and second internal electrodes, the body having first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces; a first external electrode disposed on the first surface, and extending onto a portion of each of the third to sixth surfaces; a second external electrode disposed on the second surface, and extending onto a portion of each of the third to sixth surfaces, wherein, in at least one of cross-sections in first and second directions or in first and third directions, in at least one of the first and second external electrodes, a maximum thickness in a peripheral portion of the first and second surfaces is greater than a maximum thickness in a center portion, and a maximum thickness in a center portion is greater than a maximum thickness in a corner portion.

Ceramic electronic component

A control system for operating an air vehicle for urban air mobility (UAM) is arranged such that when a steering operation for a steering wheel and a stroke operation for an accelerator pedal and a brake pedal are performed for operating the air vehicle for UAM, haptic feedback providing notification of any operational limitations is provided to a driver, so that operation stability and convenience of the driver are secured and stable steering, acceleration, and deceleration of the air vehicle are performed.

Control system for operating air vehicle for urban air mobility

A method of manufacturing a multilayer electronic component, the method includes, attaching a margin portion green sheet including a ceramic material, a photocuring agent, and a photoinitiator to at least one end surface of each of the plurality of cut ceramic green sheet stacked bodies in the third direction, an energy irradiation operation of irradiating, with energy, the margin portion green sheet to generate a photocuring polymerization reaction between the photocuring agent and the photoinitiator.

Multilayer electronic component and method of manufacturing multilayer electronic component

A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and a cover portion disposed on end surfaces of the capacitance forming portion; and an external electrode disposed on the body, wherein a ratio of an average content of zirconium (Zr) included in the capacitance forming portion to an average content of zirconium (Zr) included in the cover portion satisfies 0.55 or more and 1.00 or less, wherein an average content of zirconium (Zr) included in the capacitance forming portion satisfies 1073 ppm or more and 1950 ppm or less, and wherein an average size of the dielectric grains included in a central region of the capacitance forming portion is 200 nm or more and 300 nm or less, and a standard deviation for a size is 100 nm or more and 130 nm or less.

A multilayer electronic component, may include: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other, third and fourth surfaces opposing each other, and fifth and sixth surfaces opposing each other, the first surface including first and second band electrodes disposed to be spaced apart from each other; a first external electrode disposed on the third surface and connected to the first internal electrode and the first band electrode; a second external electrode disposed on the fourth surface and connected to the second internal electrode and the second band electrode; a first plating layer disposed on the first external electrode and the first band electrode; and a second plating layer disposed on the second external electrode and the second band electrode.

A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with respective dielectric layers interposed therebetween; a first external electrode including a first connection portion, and first and second band portions extending from the first connection portion; a second external electrode including a second connection portion, and second and fourth band portions extending from the second connection portion; an insulating layer disposed to extend to a portion on the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer. An average thickness of the first or second plating layer is smaller than an average thickness of the insulating layer.

Multilayer electronic component with improved reliability

A film for manufacturing an electronic component includes: a polymer layer; and metal nanowires dispersed in the polymer layer. The polymer layer may include a polyester-based compound such as polyethylene terephthalate. The metal nanowire may include a ferromagnetic metal such as at least one of nickel (Ni), cobalt (Co), and iron (Fe), or alloys thereof.

Film for manufacturing electronic component

A multilayer ceramic capacitor includes a ceramic body having a dielectric layer, a plurality of internal electrodes disposed in the ceramic body, and a first side margin portion and a second side margin portion arranged on end portions of the internal electrodes exposed through respective opposing surfaces of the ceramic body. The ceramic body includes an active portion having the plurality of internal electrodes arranged to overlap each other with the dielectric layer interposed therebetween to form capacitance, and cover portions disposed above an uppermost and below a lowermost internal electrode of the active portion. The first and second side margin portions include tin (Sn), and a content of Sn included in the first and second side margin portions is greater than a content of Sn included in the dielectric layer of the active portion.

Multilayer ceramic capacitor and method of manufacturing the same

A multilayer electronic component includes a body including first and second surfaces opposing each other in the first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, a first external electrode including a first base electrode layer including glass and Ni and disposed on the third surface, a first intermediate electrode layer including an alloy containing Sn and Ni and disposed on the first base electrode layer, and a first conductive resin layer including a resin and a metal and disposed on the first intermediate electrode layer and extending to the first and second surfaces, a second external electrode including a second base electrode layer disposed on the fourth surface, a second intermediate electrode layer disposed on the second base electrode layer, and a second conductive resin layer disposed on the second intermediate electrode layer.

Multilayer electronic component and method of manufacturing the same

A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; a first external electrode including a first connection portion and first and third band portions extending from ends of the first connection portion; a second external electrode including a second connection portion and second and fourth band portions extending from the second connection portion; an insulating layer disposed on the first and second connection portions and covering a top surface of the body and the third and fourth band portions; first and second plating layers disposed on the first and second band portions, respectively. An end of the plating layer and an end of the insulating layer contact with each other, and a thickness of the end of the plating layer and a thickness of the end of the insulating layer decreases toward the contact point.

Multilayer electronic component having structure for improved adhesion force and moisture protection

Growing community of inventors

Suwon-si, South Korea

Jong Ho Lee