Nepes Co., Ltd.

Jong Ho Han

Young Mo Lee

Gi Jo Jung

Chang Yong Jo

Jung Sic Oh

A semiconductor package includes a semiconductor chip including a chip pad on a first surface thereof, an external pad electrically connected to the chip pad of the semiconductor chip, an external connection terminal covering the external pad, and an intermediate layer between the external pad and the external connection terminal, the intermediate layer including a third metal material that is different from a first metal material included in the external pad and a second metal material included in the external connection terminal.

Growing community of inventors

Cheongju-si, South Korea

Jong Ho Han