Samsung Electronics Co., Ltd.

Jong Hee Choi

Young Jae Song

Tae Je Cho

Do Soo Jeong

Kwan Jai Lee

Chang Cheol Lee

Si H Yoo

Nack H Jung

Suk Hong Chang

Beung Seuck Song

A multi-chip stack package does not include a die pad. The elimination of the die pad provides more room for elements in the package which. Thus, a balanced inner package structure can be achieved, and a poor molding which may expose one of the package elements can be avoided. In the package, an upper chip is bonded to the top surface of a lower chip. To stabilize the chips, auxiliary or inner leads of a lead frame attach to the top surface of a lower chip. This shortens wire lengths between the chips and the inner leads. The shorter wires reduce wire loop heights and thus reduce the probability of exposing wires in a subsequent transfer-molding. A multi-chip stack package which includes an auxiliary lead(s) is also disclosed. The auxiliary leads attach to the top surface of the lower chip and can provide a stable support of a semiconductor chip and prevent the chip from tilting and shifting in transfer-molding. An auxiliary lead can be between the lower and upper chips. The auxiliary leads can also be positioned to prevent undesirable spreading of an adhesive when an upper chip is attached to a lower chip.

Multi-chip package

An air conditioner includes a compressor, an indoor heat exchanger, an expansion tube, and an outdoor heat exchanger interconnected by refrigerant conduits for operation in cooling and heating modes. In a cooling mode, the outdoor heat exchanger conducts ambient air horizontally across heat exchange coils. In a heating mode, the outdoor heat exchanger conducts heated air from an auxiliary gas-fired heater upwardly across those same coils. The outdoor heat exchanger includes movable blades for creating the horizontal and vertical air flow passages for the cooling and heating modes.

Air conditioner having supplemental gas heater for outdoor coil

Growing community of inventors

Suwon, South Korea

Jong Hee Choi