Semes Co., Ltd.

Jong Han Kim

Seong Soo Lee

Do Gyeong Ha

Hyeon Jun Lee

Seung Tae Yang

Ju Hwan Lee

Yoon-Jong Ju

Yu Hwan Kim

Ji Ho Kim

Edwin Lee

Ju Dong Lee

A substrate processing apparatus a processing liquid supply unit includes a nozzle supplying a processing liquid onto the substrate, a supply line connected to the nozzle to supply the processing liquid to the nozzle, and a cooler cooling the processing liquid. A volume of the processing liquid is reduced by the cooler so that the processing liquid may be sucked.

Substrate processing apparatus and substrate processing method including processing liquid supply unit

The inventive concept provides a liquid treating apparatus. The liquid treating apparatus includes a spin chuck configured to support and rotate a substrate; and a liquid supply unit configured to supply a liquid to the substrate, and wherein the liquid supply unit includes: a first nozzle connected to a first flow path pipe and configured to discharge a first liquid to the substrate; a first valve assembly including a first cut-off valve for cutting-off a flow of the first liquid within the first flow path pipe and a first suck-back valve for sucking-back the first liquid, and installed at the first flow pipe; a second nozzle connected to a second flow path pipe and configured to discharge a second liquid to the substrate; a second valve assembly including a second cut-off valve for cutting-off a flow of the second liquid within the second flow path pipe and a second suck-back valve for sucking-back the second liquid, and installed at the second flow pipe path; a first flow velocity controller configured to adjust an air flow velocity of an air introduced into or outflowed from the first suck-back valve; and a second flow velocity controller configured to adjust an air flow velocity of an air introduced into or outflowed from the second suck-back valve, and wherein a first speed of a suck-back speed provided by the first valve assembly is slower than a second suck-back speed provided by the second valve assembly, and a surface tension of the first liquid is lower than a surface tension of the second liquid.

Apparatus for treating substrate using liquid and method for controlling liquid

The inventive concepts provide an apparatus for treating a substrate. The apparatus includes a housing proving an inner space in which a substrate is treated, a spin head supporting and rotating the substrate in the housing, an injection unit comprising a first nozzle member spraying a first treatment solution to the substrate put on the spin head, and a controller controlling the first nozzle member. The first nozzle member includes a body, a vibrator, a pump, and a power source.

Substrate treating apparatus and method

Growing community of inventors

Cheonan-si, Chungcheongnam-do, South Korea

Jong Han Kim