Electronics and Telecommunications Research Institute

Korea University Industrial Academic Collaboration Foundation

Gwangju Institute of Science and Technology

Ipg Electronics 502 Limited

Jong Dae Kim

Tae Moon Roh

Yil Suk Yang

Kang Ho Park

Dae Woo Lee

Young Kyun Cho

Sung Q Lee

Kwi Dong Kim

Chong Ki Kwon

Hye Jin Kim

Jae Woo Lee

Jong Kee Kwon

Seung Eon Moon

Chun Gi Lyuh

Hong Yeol Lee

Sung Ku Kwon

Woo Seok Yang

Young Deuk Jeon

Il Yong Park

Sang Kyun Lee

Mun Yang Park

Ik Jae Chun

Sang Gi Kim

Soon Il Yeo

Jin Gun Koo

Se Wan Heo

Byoung Gon Yu

Eun Kyoung Kim

Seung Chul Lee

Nak Jin Choi

Jong Hyurk Park

Hyung Kun Lee

Jung Hee Suk

Chang Han Je

Sang Heung Lee

Min Cheol Shin

Gyu Tae Kim

Gyu Hyung Cho

Kwang Man Kim

Moon Gyu Jang

Ja Yol Lee

Young Gi Lee

Ki Chul Kim

Min Gyu Choi

Yi Gyeong Kim

Kee Soo Nam

Gyu Hyun Kim

Kun Mo Koo

Sang Hyo Lee

Jung Hoon Kim

Kyoung Ik Cho

In Gi Lim

Nak Woong Eum

Hui Dong Lee

Seong Mo Park

Jin Ho Han

Gyu Hyeong Cho

Mi Young Lee

Dae Sik Lee

Hyung Il Park

Han Jin Cho

Min Hyung Cho

Hee Bum Jung

Byoung-Gon Yu

Hye-Jin Kim

Won Chul Song

Seung Chul Kim

Min Ki Kim

Hyun Joong Lee

Sang Ki Kim

Il-yong Park

Yong Seo Koo

Hyun Jin Ji

Do Young Jang

Myung Shin Kwak

Myung Shin Kwark

Roh Tae Moon

Yang Yil Suk

Ii Yong Park

Ji Min Oh

II-Young Park

Sang Hun Yoon

Se Hoon Yoo

Hye Yeon Ryu

Eung Seook Park

Se Myung Wang

Dae Sung Kim

Jung Hwan Huh

Ju Hyun Lee

So Jeong Park

Myung Sin Kwark

The present invention relates to a digital clock generation apparatus. The digital clock generation apparatus is directed to providing a digital clock generation apparatus in which hardware is simple, duty cycles are easily controlled, and various duty cycles and various frequency clocks (n&#xd7; clocks) are provided as compared to a 1&#xd7; single-phase clock generation apparatus or a 1&#xd7; multi-phase clock generation apparatus based on the conventional programmable delay element chain.

Digital clock generation apparatus and method

Disclosed is an electrochemical gas sensor using micro electro mechanical systems (MEMS). The MEMS electrochemical gas sensor includes: a substrate a lower central region of which is etched by a predetermined thickness; a first insulation film formed on the substrate; a heat emitting resistance body formed on the first insulation film; a second insulation film formed on the heat emitting resistance body; a reference electrode formed in an upper central region of the second insulation film; a solid electrolyte formed on the reference electrode; and a detection electrode formed on the solid electrolyte.

MEMS electrochemical gas sensor

Disclosed is an energy storage system provided with a wired and wireless energy transfer function. The energy storage system includes: an energy input unit to which energy generated from a plurality of energy sources is input; an energy input control unit for selecting one energy source from among the plurality of energy sources, and transferring energy of the selected energy source through operation in a wired operation mode or a wireless operation mode; a wireless energy transmitting/receiving unit for wirelessly transmitting/receiving the energy of the selected energy source during the operation in the wireless operation mode of the energy input control unit; an energy storage/control unit for storing the energy of the selected energy source; an energy output unit for consuming the energy stored in the energy storage/control unit; and an energy output control unit for distributing the energy stored in the energy storage/control unit to the energy output unit.

Energy storage system with wired and wireless energy transfer function

Disclosed are a gas sensor, and a method of manufacturing and using the same. The method includes: forming a detection material on a heater; coating an encapsulant on the detection material; and heating the heater to remove the encapsulant from the detection material when the gas sensor is operated.

Gas sensor and method of manufacturing the same

A method of manufacturing a piezoelectric speaker comprises forming a piezoelectric thin film and then forming an upper electrode and a lower electrode on and beneath the piezoelectric thin film, respectively, forming a damping material layer for attachment of the piezoelectric thin film below the piezoelectric thin film with the upper and lower electrodes formed thereon and therebeneath, attaching the piezoelectric thin film to an acoustic diaphragm in an inclined structure in which the piezoelectric thin film is horizontally turned from the acoustic diaphragm, and performing drying at room temperature; and fixing the acoustic diaphragm to a frame using an adhesive material with high elasticity.

Method of manufacturing a piezoelectric speaker

A method for fabricating an acoustic sensor according to an exemplary embodiment of the present disclosure includes: forming an acoustic sensor unit by forming a lower electrode on an upper portion of a substrate, forming etching holes on the lower electrode, forming a sacrifice layer on an upper portion of the lower electrode, and coupling a diaphragm to an upper portion of the sacrifice layer; coupling a lower portion of the substrate of the acoustic sensor unit to a printed circuit board on which a sound pressure input hole is formed so as to expose the lower portion of the substrate of the acoustic sensor unit to the outside through the sound pressure input hole; attaching a cover covering the acoustic sensor unit on the printed circuit board; etching the substrate of the acoustic sensor unit to form an acoustic chamber; and removing the sacrifice layer.

Acoustic sensor and fabrication method thereof

Disclosed is a piezoelectric speaker including: a piezoelectric layer that converts electrical signals into oscillation and outputs sound; an electrode that is formed on a top or a bottom of the piezoelectric layer to apply the electrical signals to the piezoelectric layer; an acoustic diaphragm that is made of a hetero material including a first acoustic diaphragm and a second acoustic diaphragm and is attached to the bottom of the piezoelectric layer on which the electrode is formed; and a frame attached in a form enclosing a side of the acoustic diaphragm.

Piezoelectric speaker

A security system and a method of determining whether there is an intrusion are provided. A correlation between sound signals obtained from a sound source generating device and a sound-field variation measuring device is used to measure a acoustic field in a certain space. A difference between an initially set acoustic field and a changed acoustic field is used to determine whether there is an intruding object in a certain space. The security system includes a sound source generating device for generating a sound source; and a sound-field variation measuring device for measuring a acoustic field formed by the sound source, wherein an initially set acoustic field is compared with the measured acoustic field to determine whether there is an intrusion.

Security system and method using measurement of acoustic field variation

An apparatus that calculates a Sum of Absolute Differences (SAD) for motion estimation of a variable block capable of parallelly calculating SAD values with respect to multiple current frame macroblocks at a time is presented. The apparatus includes a PE array unit including at least one Processing Element (PE) that is aligned in the form of a matrix, and parallelly calculating a SAD value of at least one pixel provided in multiple serial current frame macroblocks, a local memory including current frame macroblock data, reference frame macroblock data, and reference frame search area data, and transmitting the data to each PE that is provided in the PE array unit, and a controller for making a command for the data that are provided in the local memory to be transmitted corresponding to at least one pixel, on which each PE provided in the PE array unit performs calculation.

Apparatus and method for calculating sum of absolute differences for motion estimation of variable block

Provided are a micro-electromechanical systems (MEMS) microphone and a method of manufacturing the same. A manufacturing process is simplified compared to a conventional art using both upper and lower substrate processes. Since defects which may occur during manufacturing are reduced due to the simplified manufacturing process, the manufacturing throughput is improved, and since durability of the MEMS microphone is improved, system stability against the external environment is improved.

Micro-electromechanical systems (MEMS) microphone and method of manufacturing the same

A piezoelectric speaker and a method of manufacturing the same that can obtain a high sound pressure using a piezoelectric thin film are provided. The piezoelectric speaker includes a piezoelectric thin film, electrodes formed on an upper surface or upper and lower surfaces of the piezoelectric thin film, a damping material layer formed on the lower surface of the piezoelectric thin film, and a frame attached around at least one of the piezoelectric thin film and the damping material layer using an adhesive.

Piezoelectric speaker and method of manufacturing the same

Disclosed are a MEMS microphone and a method of manufacturing the same. The MEMS microphone includes: a substrate; a rear acoustic chamber formed inside a front surface of the substrate; a vibrating plate formed on the substrate and having an exhaust hole; a fixed electrode formed on the vibrating plate; and a fixed electrode support supported by a bottom of the rear acoustic chamber and connected to the fixed electrode through the exhaust hole.

MEMS microphone and method of manufacturing the same

Disclosed are an MEMS type semiconductor gas sensor using a microheater having many holes and a method for manufacturing the same. The MEMS type semiconductor gas sensor includes: a substrate of which a central region is etched with a predetermined thickness; a second membrane formed at an upper portion of the central region of the substrate and having many holes; a heat emitting resistor formed on the second membrane and having many holes; a first membrane formed on the second membrane including the heat emitting resistor and having many holes; a sensing electrode formed on the first membrane and having many holes; and a sensing material formed on the sensing electrode.

Microelectromechanical systems type semiconductor gas sensor using microheater having many holes and method for manufacturing the same

A condenser microphone having a flexure hinge diaphragm and a method of manufacturing the same are provided. The method includes the steps of: forming a lower silicon layer and a first insulating layer; forming an upper silicon layer on the first insulating layer; forming sound holes by patterning the upper silicon layer; forming a second insulating layer and a conductive layer on the upper silicon layer; forming a passivation layer on the conductive layer; forming a sacrificial layer on the passivation layer; depositing a diaphragm on the sacrificial layer, and forming air holes passing through the diaphragm; forming electrode pads on the passivation layer and a region of the diaphragm; and etching the layers to form an air gap between the diaphragm and the upper silicon layer. Consequently, a manufacturing process may improve the sensitivity and reduce the size of the condenser microphone.

Condenser microphone having flexure hinge diaphragm and method of manufacturing the same

Provided are a vacuum-sealing-type flexible-film primary battery and a method of manufacturing the same. The primary battery includes a battery assembly comprising a positive electrode plate including a positive electrode collector having a first conductive carbon layer disposed directly on a surface-treated inner surface of a first pouch and a positive electrode layer disposed on the first conductive carbon layer of the positive electrode collector, a negative electrode plate including a negative electrode collector having a second conductive carbon layer disposed directly on a surface-treated inner surface of a second pouch and a negative electrode layer disposed on the second conductive carbon layer of the negative electrode collector, and an adhesion/post-injection polymer electrolyte layer interposed between the positive electrode plate and the negative electrode plate, wherein the battery assembly is completely sealed. The flexible-film primary battery may employ the pouch as a collector film to improve flexibility. Also, the flexible-film primary battery may be completely sealed using the pouch to improve a retention period and cell performance. Furthermore, the flexible-film primary battery may be manufactured using a screen printing technique, thereby facilitating a roll-to-roll sequential process.

Vacuum-sealing-type flexible-film primary battery

Growing community of inventors

Daejeon, South Korea

Jong Dae Kim