Hynix Semiconductor Inc.

Skhynix Inc.

Jong-Chern Lee

Seung-Joon Ahn

Dae-Suk Kim

Sang-Jin Byeon

Jun-Gi Choi

Hyun-Su Yoon

Je-Yoon Kim

Chul Kyu Kim

Kyung-Whan Kim

Jae-Bum Ko

Young-Jun Ku

Jong-Sam Kim

Hee-Jin Byun

Young-Jae Choi

Sun-Hye Shin

Jang-Ryul Kim

Mi-Hyun Hwang

Sin-Hyun Jin

Jae-Woong Yun

Disclosed are a memory device and an operating method thereof, and the memory device includes a plurality of first data lines, a plurality of second data lines, a common redundant memory region coupled to at least one repair line of the second data lines, a plurality of normal memory regions coupled to the first data lines in common, and coupled in common to the remaining the second data lines excluding the repair line, and a repair circuit coupled to the first and second data lines, and suitable for replacing at least one defective memory cell in the normal memory regions with at least one redundant memory cell in the common redundant memory region by shifting some or all of the first data lines to some or all of the second data lines, based on a row address, a column address and a region address.

Memory device and operating method thereof

Disclosed herein is a stacked memory device including a base die and a plurality of core dies stacked using a plurality of through-chip electrodes. Each of the core dies may include a plurality of input pads capable of receiving addresses externally in a wafer-level test mode; a control signal generation unit capable of decoding the addresses received through the input pads to generate a first control signal; an address generation unit capable of generating a first address based on the addresses received through the input pads; and a signal selection unit capable of selecting one of the first control signal and a second control signal received from the base die through a corresponding through-chip electrode to output a global control signal, and selecting one of the first address and a second address received from the base die through a corresponding through-chip electrode to output a global address.

Stacked memory device and semiconductor memory system including the same

A semiconductor device includes: first to Ninput terminals (where N is an integer equal to or greater than 2); and a redundant input terminal. When a Kinput terminal (where K is an integer ranging from 1 to N&#x2212;1) is defective among the first to Ninput terminals, (K+1)to Ninput terminals receive signals of Kto (N&#x2212;1)input terminals, respectively, and the redundant input terminal receives a signal of the Ninput terminal.

Semiconductor device

A semiconductor integrated circuit includes a plurality of semiconductor chips respectively selected in response to a plurality of chip selection signals, and a chip selection signal generator configured to generate the chip selection signals in response to one first control signal for deciding whether to drive the semiconductor chips and at least one second control signal for selecting at least one semiconductor chip from among the semiconductor chips.

Semiconductor integrated circuit and semiconductor system including the same

An integrated circuit that detects whether a through silicon via has defects or not, at a wafer level. The integrated circuit includes a semiconductor substrate, a through silicon via configured to be formed in the semiconductor substrate to extend to a certain depth from the surface of the semiconductor substrate, an output pad, and a current path providing unit configured to provide a current, flowing between the semiconductor substrate and the through silicon via, to the output pad during a test mode.

Integrated circuit for detecting defects of through chip via

A semiconductor system for identifying stacked chips includes a first semiconductor chip and a plurality of second semiconductor chips. The first semiconductor chip generates a plurality of counter codes by using an internal clock or an external input clock and transmits slave address signals and the counter codes through a through-chip via. The second semiconductor chips are given corresponding identifications (IDs) by latching the counter codes for a predetermined delay time, compare the latched counter codes with the slave address signals, and communicate data with the first semiconductor chip through the through-chip via according to the comparison result.

Semiconductor system and device for identifying stacked chips and method thereof

A semiconductor wafer includes at least one chip formed on a substrate, and a scribe line region surrounding the chip. The chip includes a device formation region, and a chip boundary region surrounding the device formation region and formed between the device formation region and the scribe line region. The chip boundary region includes a guard ring structure which physically separates the device formation region from the scribe line region. The guard ring structure includes a signal transfer element which transfers an electric signal between the device formation region and the scribe line region.

Semiconductor chip and semiconductor wafer

A semiconductor memory device includes a plurality of data transmission lines, a plurality of parallel-to-serial conversion sections configured to receive, serially align, and output data from at least two of the plurality of data transmission lines, a plurality of data compression circuits configured to receive, compress, and output outputs of at least two of the plurality of parallel-to-serial conversion sections, and a plurality of data output circuits configured to output respective compression results of the plurality of data compression circuits to an outside of a chip.

Semiconductor memory device and method for performing data compression test of the same

A semiconductor integrated circuit having a multi-chip structure includes a plurality of stacked semiconductor chips. At least one of the semiconductor chips includes first and second metal layers separately formed inside the semiconductor chip, a first internal circuit coupled in series between the first and second metal layers inside the semiconductor chip, a first metal path vertically formed over the second metal layer to a first side of the semiconductor chip, and a first through silicon via formed through the semiconductor chip from a second side of the semiconductor chip to the first metal layer.

Semiconductor integrated circuit having a multi-chip structure

An open loop type delay locked loop includes a delay amount pulse generation unit configured to generate a delay amount pulse having a pulse width corresponding to a delay amount for delay locking a clock signal, a delay amount coding unit configured to output a code value by coding the delay amount in response to the delay amount pulse, a clock control unit configured to adjust a toggling period of the clock signal in response to a control signal, and a delay line configured to delay an adjusted clock signal outputted from the clock control unit in response to the code value.

Open loop type delay locked loop and method for operating the same

A duty cycle correction circuit includes a duty cycle control unit configured to generate a corrected clock signal by correcting a duty cycle of an input clock signal in response to a control signal, a duty cycle detection unit configured to detect a duty cycle of the corrected clock signal and output a detection signal, and a control signal generation unit configured to generate the control signal in response to the detection signal.

Duty cycle correction circuit

A delay locked loop includes a delay pulse generation unit, a coding unit, and a delay line. The delay pulse generation unit is configured to generate a delay pulse having a certain width. The coding unit is configured to code the delay pulse and output a code value. The delay line is configured to delay an input clock by the code value, and generate a delayed locked clock. The delay pulse has a logic high level state during a third period equivalent to a difference between a first period, which corresponds to an integer multiple of the input clock, and a second period, which is a certain replica delay period.

Delay locked loop and method for driving the same

A command control circuit of a semiconductor integrated device includes a plurality of latches sequentially connected and receiving a command signal, and a plurality of selection switches configured to pass or to interrupt the command signal inputted to each one of the plurality of latches.

Command control circuit for semiconductor integrated device

A temperature detection circuit of a semiconductor memory apparatus includes a fixed period oscillator, a temperature variable signal generating unit and a counting unit. The oscillator is configured to generate a fixed period oscillator signal when an enable signal is enabled. The temperature variable signal generating unit is configured to generate a temperature variable signal whose enable interval varies based on temperature variations, when the enable signal is enabled. The counting unit is configured to count the oscillator signal during the enable interval of the temperature variable signal to generate a temperature information signal.

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Gyeonggi-do, South Korea

Jong-Chern Lee