Samsung Electro-Mechanics Co., Ltd.

Sungkyunkwan University

Jong Bong Lim

Hai Joon Lee

Seok Hyun Yoon

Ji Hyun Park

Doo Young Kim

Jae Yeol Choi

Ju Hwan Yang

Doo Il Kim

Sang Huk Kim

Jong Pil Lee

Chang Sik Kim

Chang Hoon Kim

Seok Il Hong

Young Seuck Yoo

Jae Sung Park

No Il Park

Seung Woo Song

Suk Hyun Song

Dae Ho Yoon

Takaki Masaki

Makoto Kosaki

A multilayer ceramic capacitor (MLCC) includes: a ceramic body having a plurality of dielectric layers, first internal electrodes, and second internal electrodes; and a first external electrode and a second external electrode, disposed on an exterior of the ceramic body. A plurality of via electrodes are disposed in the ceramic body; a first via electrode connects the first internal electrodes to the first external electrode; a second via electrode connects the second internal electrodes to the second external electrode; and the plurality of via electrodes have a stepped shape, and a distance in a length direction from a first vertical edge of each step to a second vertical edge of each step in the plurality of via electrodes is increased in a direction from the substrate toward an upper portion of the ceramic body.

Multilayer ceramic capacitor having via electrode and method of manufacturing the same

A monolayer thin film capacitor includes: a bottom electrode; a top electrode; a dielectric layer disposed between the bottom electrode and the top electrode; a first via formed in the dielectric layer so as to penetrate through the dielectric layer; a second via formed in the top electrode so as to penetrate through the top electrode and having a greater width or a greater diameter than that of the first via; and a connection electrode disposed on inner sides of the first and second vias, electrically connected to the bottom electrode, and electrically insulated from the top electrode.

Monolayer thin film capacitor and method for manufacturing the same

A resistor element includes a substrate having first and second surfaces facing each other, and a plurality of side surfaces connecting the first surface and the second surface with each other. A resistance layer is on at least one of the first and second surfaces. A first terminal and a second terminal are connected to the resistance layer, and each include a first electrode layer on the first surface, a second electrode layer on the second surface, and a plurality of side electrode layers on at least a portion of the plurality of side surfaces. At least a portion of the side surfaces of the substrate is exposed between side electrode layers of the first terminal.

Resistor element

A coil component and a method of manufacturing the coil component are provided. The coil component includes a coil part, a body, and an electrode. The coil part includes a support member, a first coil layer disposed on one surface of the support member, and a second coil layer disposed on the first coil layer. The body includes a magnetic material covering the coil part. The electrode is disposed on the body and is connected to the coil part. The first and second coil layers may each include an insulating layer having a pattern in a planar coil shape and a conductor layer disposed in the pattern and including a seed layer and a plating layer. Additionally, seed layers of the first and second coil layers may be disposed differently in the conductor layers of the first and second coil layers.

Coil component and method of manufacturing the same

Disclosed herein is a thin film type capacitor element, including: a body part formed by stacking a plurality of dielectric layers; a first internal electrode provided in the body part and including a first non-plated region; a second internal electrode including a second non-plated region; a first via formed in the first non-plated region; and a second via formed in the second non-plated region.

Thin film type capacitor element and method of manufacturing the same

A coil component includes a substrate and a coil pattern disposed on the substrate. The coil pattern includes a vertical region having a side surface perpendicular with respect to the substrate and a tapered region connected to the vertical region and having a side surface inclined with respect to the substrate.

A thin film type coil component including coil patterns in a cross section shape having an undercut in lower portions thereof is provided. The coil patterns may reduce parasitic capacitance between the coil patterns, thereby minimizing electrical loss. The volume of the coil patterns may be increased, thereby improving inductance and resistance characteristics.

Thin film type coil component and method of manufacturing the same

Capacitor element and method of manufacturing the same

An electronic component includes a body part and a via part. The body part includes first and second metal layers disposed with at least one dielectric layer interposed therebetween. The via part is disposed in the body part and includes first and second vias penetrating through the body part and selectively connected to the first and second metal layers, respectively. The first and second metal layers contain different metals. In some examples, a first insulating film is disposed between the first metal layer and the second via to electrically insulate the second via from the first metal layer, and a second insulating film is disposed between the second metal layer and the first via to electrically insulate the first via from the second metal layer. A method for forming the electronic component includes use of first and second etchants to selectively etch the first and second metal layers.

Electronic component and method of manufacturing the same

Monolayer thin film capacitor

There are provided a dielectric composition for low-temperature sintering and a multilayer ceramic electronic component manufactured using the dielectric composition and the dielectric composition may contains: BaTiOas a main ingredient; and a LiO&#x2014;BaO compound as an accessory ingredient, wherein the accessory ingredient is contained in an amount of 0.2 mol % to 0.8 mol %, on the basis of 100 mol % of the main ingredient.

Dielectric composition for low-temperature sintering, multilayer ceramic electronic component containing the same, and method of manufacturing multilayer ceramic electronic component

A dielectric composition includes a base main component including Ba and Ti and an accessory component, wherein a ratio of domain width/grain size of the dielectric composition is in the range of 0 to 0.2, a multilayer ceramic capacitor using the same, and a method for manufacturing a multilayer ceramic capacitor. It is possible to provide a dielectric composition that can implement a higher dielectric constant and good high temperature withstand voltage characteristics in the same grain size condition. It is expected that this effect can be effectively applied to the development of ultra high capacity MLCCs having a thin dielectric by implementing the same capacity while increasing the thickness of the dielectric than the case of applying the conventional dielectric material.

Dielectric composition, multilayer ceramic capacitor using the same, and method for manufacturing multilayer ceramic capacitor

A dielectric composition to be sintered at low temperature may include BaTiOas a major component; and (1-x)LiO-xCuO as a minor component, wherein x is 0.1 to 0.9, and the minor component is contained in a content of 0.1 mol % to 2.0 mol % based on 100 mol % of the major component.

Dielectric composition to be sintered at low temperature, multilayer ceramic electronic component containing the same, and method of manufacturing the multilayer ceramic electronic component

There is provided a dielectric composition for low-temperature sintering including BaTiOas a main ingredient, and xBO-(1-x)BaO as an accessory ingredient, wherein x ranges from 0.25 to 0.8, and the content of the accessory ingredient ranges from 0.1 to 2.00 mol %, based on 100 mol % of the main ingredient.

Dielectric composition for low-temperature sintering, multilayer ceramic electronic component including the same, and method of manufacturing multilayer ceramic electronic component

There are provided a dielectric ceramic composition and a multilayer ceramic capacitor including the same. The dielectric ceramic composition according to embodiments of the present disclosure includes a base powder represented by xSrTiO-(1&#x2212;x)BiMO(M includes Mg and Ti) containing a first main component represented by SrTiOand a second main component represented by BiMO, wherein x satisfies 0.5&#x2266;x&#x2266;0.9.

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Suwon-si, South Korea

Jong Bong Lim