Samsung Electro-Mechanics Co., Ltd.

Jong Beom Shin

Dong Won Kim

Doo Young Kim

Youn Sik Jin

Hyun Woo Kim

Hyun Kyu Im

Hyung Kyu Shim

Disclosed herein are a stacked chip device including: a stacked body in which a plurality of sheets having an internal electrode made of a conductive material are stacked; external electrodes provided at both sides of the stacked body; and connection electrodes extending from the internal electrode and electrically connecting the internal electrode with the external electrodes, wherein the connection electrodes include: a plating solution permeation preventing section extending from the internal electrode, however, extending with a thickness smaller than the thickness of the internal electrode; and a contact reinforcement section extending from the plating solution permeation preventing section, however, extending in the form in which the thickness thereof is gradually extended toward the external electrode, and a manufacturing method thereof.

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Gyeongsangnam-do, South Korea

Jong Beom Shin