Samsung Electro-mechanics Co., Ltd.

Jong Beom Kim

Tae Kyung Lee

Chang Hyun Lim

Kyo Yeol Lee

Seung Wook Park

Tae Yoon Kim

Sang Jin Kim

Seung Mo Lim

Jong Woon Kim

Sang Uk Son

Won Chul Sim

Won Jae Han

Hwa Sun Lee

Hyun Ho Shin

Jin Suk Son

Hai Joon Lee

Sang Heon Han

Jae Chang Lee

Sung Sun Kim

Sung Soo Lee

Byung Hun Kim

Dong Joon Oh

Ho Phil Jung

Kwang Su Kim

Min Jae Ahn

A bulk acoustic wave resonator includes a substrate, a first electrode, wherein a cavity is formed between the substrate and the first electrode, a piezoelectric layer disposed on the first electrode and overlapping at least a portion of the first electrode, a second electrode disposed on the piezoelectric layer and overlapping at least a portion of the piezoelectric layer, a passivation layer having at least a portion disposed on the second electrode and overlapping at least a portion of the second electrode, and a lower frame spaced apart from the substrate and having a portion of the cavity disposed therebetween. Any one of the second electrode and the passivation layer includes a protruding portion having a first thickness and an extended portion having a second thickness less than the first thickness, and an inner end of the lower frame and an end of the protruding portion are spaced apart horizontally.

Bulk acoustic wave resonator

An acoustic resonator comprises a substrate, a resonant portion disposed on the substrate and in which a first electrode, a piezoelectric layer, and a second electrode are stacked, a protective layer disposed on an upper portion of the resonant portion, and a hydrophobic layer formed on the protective layer, and the protective layer comprises a first protective layer stacked on the second electrode and a second protective layer stacked on the first protective layer, wherein a density of the second protective layer is higher than a density of the first protective layer.

Acoustic resonator

An acoustic resonator package includes a substrate, an acoustic resonator disposed on the substrate, the acoustic resonator including a first hydrophobic layer, a cap configured to accommodate the acoustic resonator, a bonding portion configured to bond the substrate to the cap, and a second hydrophobic layer disposed on the substrate at a position between the acoustic resonator and the bonding portion.

Acoustic resonator package and method of fabricating the same

A thin film capacitor includes a body including a lower electrode formed on a substrate, a plurality of first electrode layers, and a plurality of second electrode layers stacked alternately with the plurality of first electrode layers, with one of the dielectric layers interposed therebetween. The lower electrode and the first electrode layer have the same polarity as each other, and surface roughness of the first and second electrode layers is less than that of the dielectric layers, thereby securing capacitance and characteristics of the dielectric layers.

Thin film capacitor and manufacturing method thereof

There is provided a MEMS sensor including: a mass body; a support part floatably supporting the mass body; and a flexible beam having one end connected to the mass body and the other end connected to the support part. At least one end of the flexible beam connected to the mass body or the support part includes a curved portion to maximize an effective length supporting a load.

Micro electro mechanical systems sensor

A lens driving device includes a fixed member, a movable member configured to move with respect to the fixed member, a lens disposed in or on the moveable member, a connection member connecting the fixed member to the movable member, and a protective member disposed on a connection portion. The connection portion is between the fixed member and the connection member or between the movable member and the connection member.

Lens driving device

Disclosed herein is an ejecting apparatus including: an upper body which includes an inlet through which ejectable fluid flows in from an external source, a channel which fluidly communicates with the inlet and through which the ejectable fluid flows, and an upper mounting portion which fluidly communicates with the channel and is opened downwardly; a lower body which includes a lower mounting portion which is opened upwardly to correspond to the upper mounting portion, and a nozzle slit which fluidly communicates with the lower mounting portion to eject the ejectable fluid to an outside, the lower body being fastened to the upper body, and a nozzle chip which is interposed between the upper mounting portion and the lower mounting portion to receive the ejectable fluid from the channel and discharge the ejectable fluid into the nozzle slit by being driven by an actuator.

Apparatus for ejecting droplets

Growing community of inventors

Suwon-si, South Korea

Jong Beom Kim